2000 IEEE Emerging Technologies Symposium on Broadband, Wireless Internet Access. Digest of Papers (Cat. No.00EX414)
DOI: 10.1109/ets.2000.916535
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VIA/BGA/sup (R)/: a low-cost, high-performance packaging technology for broadband telecommunications

M.P.R. Panicker1,
M. Hyslop2,
Stuart O. Nelson3
et al.
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