A Novel De-embedding Technique for Millimeter-wave Package Characterization

We present a 36GHz ball grid array (BGA) package design and its experimental characterization. A novel wide band de-embedding technique has been developed for accurate characterization of the package. A hybrid model has been developed for the transition including the ball and via interconnection and is verified with the measurement data of a microstrip line test structure. The transition demonstrates an insertionloss better than 0.3dB to 36GHz. The performance is demonstrated by measuring a MMIC amplifier built on the package. Our results show that the BGA is a cost-effective solution for millimeter wave RFIC packaging.

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Development of a 36 GHz millimeter-wave BGA package

Liang

Laskar²,

Hyslop³

et al.

2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)

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A Novel De-embedding Technique for Millimeter-wave Package Characterization

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Development of a 36 GHz millimeter-wave BGA package

Development of a 36 GHz millimeter-wave BGA package

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