2007
DOI: 10.1088/0960-1317/18/2/025003
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Development of a comprehensive model for RIE-lag-based three-dimensional microchannel fabrication

Abstract: This paper presents an etch technique capable of three-dimensional (3D) design control for microfluidic channels via reactive ion etching (RIE) lag effects. Predictable results are achieved by the development of a complex Langmuir model relating the exposed surface geometry to the depth and width of microfabricated channels that result after isotropic etching of silicon. The model captures the increase in isotropic etch rate as the amount of the exposed surface area increases. The technique is based on the mos… Show more

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Cited by 29 publications
(22 citation statements)
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“…Recent reports have shown that it is possible to generate isotropic microstructures comprised of curved surfaces by varying the geometrical patterns of the mask layout and using DRIE. This fabrication approach, which is used to etch silicon to different depths using a single-etch step process, is based on the applicability of RIE lag and its dependence on the geometrical patterns of the mask layout [49,50]. …”
Section: Fabrication Techniquesmentioning
confidence: 99%
“…Recent reports have shown that it is possible to generate isotropic microstructures comprised of curved surfaces by varying the geometrical patterns of the mask layout and using DRIE. This fabrication approach, which is used to etch silicon to different depths using a single-etch step process, is based on the applicability of RIE lag and its dependence on the geometrical patterns of the mask layout [49,50]. …”
Section: Fabrication Techniquesmentioning
confidence: 99%
“…1 were fabricated using MEMS technology from single-crystal silicon wafers. The fabrication method relies on the applicability of reactive ion etching (RIE) 1 lag and its dependence on the geometrical patterns of the photomask layout (Gantz et al 2008) to etch silicon to different depths using a single isotropic etch step and to form arrays of microchambers interconnected with microchannels. Figure 2 shows the fabrication process flow which started by the deposition of an 8,000-Å-thick oxide layer on a silicon wafer using plasma enhanced chemical vapor deposition (PECVD) 2 technique.…”
Section: Device Fabricationmentioning
confidence: 99%
“…In summary we present the development of arrays of 3-D silicon microstructures consisting of isotropic microchambers interconnected with channels using a novel single-mask 3-D fabrication process for the development of microelectromechanical systems (MEMS) and microfluidics (Gantz et al 2008). Next, we quantitatively assess the effect of the geometry of isotropic microchambers with varying width and depth on adhesion and growth behavior of normal human fibroblast cells and metastatic human breast cancer cells under static culture conditions.…”
Section: Introductionmentioning
confidence: 99%
“…In this work, we explore in detail whether the differential adhesion of these two cell types to isotropic architectures is dependent on their cytoskeletal structure and biomechanical properties. For this purpose, we developed new 3-D isotropic silicon microstructures using our novel fabrication technology (Gantz et al 2008). These microenvironments can be potentially used as novel platforms to study cytoskeletal organization of various cell lines in a 3-D architecture.…”
mentioning
confidence: 99%