Development of a Copper Heat Pipe with Axial Grooves Manufactured Using Wire Electrical Discharge Machining (Wire-EDM)

Nishida, Felipe Baptista; Marquardt, Larissa S.; Borges, Valquíria Y.S.; Santos, Paulo Henrique Dias Dos; Alves, Thiago Antonini

doi:10.4028/www.scientific.net/amr.1120-1121.1325

Cited by 4 publications

(3 citation statements)

References 4 publications

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“…Afterwards, a mathematical model was developed which was based on the experimental values obtained for the material removal rate and the surface roughness, and it was proven to be precise to predict the output response. Nishida [14] carried out experiments to analyse a heat pipe with grooves produced by a copper tube using WEDM for the application in thermal management of electronic packaging. They tried to prove with the help of the experiments that the heat pipe works successfully while testing it horizontally to increasing heat loads.…”

Section: Introductionmentioning

confidence: 99%

Analysis of the Machinability of Copper Alloy Ampcoloy by WEDM

et al. 2020

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The unconventional technology of wire electrical discharge machining is widely used in all areas of industry. For this reason, there is always an effort for efficient machining at the lowest possible cost. For this purpose, the following comprehensive study has been carried out to optimize the machining of the copper alloy Ampcoloy 35, which is particularly useful in plastic injection moulds. Within the study, a half-factor experiment of 25-1 with 10 axial points and seven central points of a total of 33 rounds was carried out, which was focused on the response monitoring of the input factors in the form of the machine parameters setup: gap voltage, pulse on time, pulse off time, discharge current, and wire speed. Based on the study of the response in the form of cutting speed and surface topography, their statistical models were created, while the optimal setting of machine parameters was determined to maximize the cutting speed and minimize the topography parameters. Further, a detailed cross-sectional analysis of surface and subsurface layer morphology was performed using electron microscopy including chemical composition analysis. In order to study microstructural changes in the material at the atomic level, a lamella was created, which was then studied using a transmission electron microscope.

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Section: Introductionmentioning

confidence: 99%

Analysis of the Machinability of Copper Alloy Ampcoloy by WEDM

et al. 2020

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“…The metal screen is the most commonly used capillary structure because of availability, ease of construction and good capillary pumping [16]. The grooves, as capillary structure, have a high thermal conductivity and good permeability [17]. As mentioned earlier, the thermosyphon is a heat pipe assisted by gravity, because it has no capillary structure to return the working fluid.…”

Section: Introductionmentioning

confidence: 99%

Thermal performance evaluation of different passive devices for electronics cooling

Krambeck¹,

Baptista²,

Marrone³

et al. 2019

THERM SCI

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The advent of modern electronic technology lead to miniaturization and high power density of electronic devices, then the existing electronic cooling techniques cannot be used, directly affecting the performance, cost, and reliability of electronic devices. Thus, the thermal management of electronic packaging has become a key technique in many products. Passive heat transfer devices can be a good alternative to the stabilization of electronic devices temperature. In this research, an experimental evaluation of the thermal performance of four different passive devices was accomplished. The considered devices were a rod, a thermosyphon, a heat pipe with a metal screen as the capillary structure, and a heat pipe with microgrooves. The heat pipe is a highly efficient device that carries large amounts of power with a small temperature difference. The heat pipe consists of the involucre, the working fluid, and the capillary structure. The thermosyphon is a kind of heat pipe assisted by gravity. In other words, it has no wick structure to return the working fluid. The devices were made of copper with a total length of 200 mm and an outer diameter of 9.45 mm. The thermosyphon and the heat pipes used deionized water as working fluid with a filling ratio of 60% of the evaporator volume. The devices were tested in vertical and horizontal positions under thermal loads between 5 W and 45 W. All the devices have operated satisfactorily when tested in accordance with the behavior of the thermal resistance. The heat pipes were the best among the tested devices and the best position was vertical.

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“…The metal screen is the most commonly used capillary structure because of availability, ease of construction and good capillary pumping [14]. The grooves, as capillary structure, have a high thermal conductivity and good permeability [15]. The sintered metal wicks are manufactured by packing tiny metal particles between the inner heat pipe wall and a mandrel in powder form [16].…”

Section: Introductionmentioning

confidence: 99%

Heat Pipe and Thermosyphon for Thermal Management of Thermoelectric Cooling

Alves¹,

Krambeck²,

dosSantos³

2018

Bringing Thermoelectricity Into Reality

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The heat pipe and thermosyphon are passive heat transfer devices with phase change, which can be applied for thermal management of thermoelectric cooling, such as the TEC hot side. The heat pipes basically consist of a metal tube sealed with capillary structure internally that is embedded with a working fluid. This capillary structure can be made of screen meshes, grooves, or sintered media. The thermosyphon is a heat pipe assisted by gravity, because it has no capillary structure. Then, in this chapter, manufacturing of low cost and easy-to-manufacture heat pipes and thermosyphon is described in detail, and an experimental evaluation of their thermal performance is accomplished. The considered devices were a rod, a thermosyphon, a mesh heat pipe, a grooved heat pipe, and a sintered heat pipe. According to the behavior of the global thermal resistance and the effective thermal conductivity, the passive devices operated satisfactorily with the exception of the rod and the thermosyphon in the horizontal position. The heat pipes were the best among the tested devices and the best position was vertical.

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Development of a Copper Heat Pipe with Axial Grooves Manufactured Using Wire Electrical Discharge Machining (Wire-EDM)

Cited by 4 publications

References 4 publications

Analysis of the Machinability of Copper Alloy Ampcoloy by WEDM

Analysis of the Machinability of Copper Alloy Ampcoloy by WEDM

Thermal performance evaluation of different passive devices for electronics cooling

Heat Pipe and Thermosyphon for Thermal Management of Thermoelectric Cooling

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