Development of a High-Porosity Fixed-Abrasive Pad Utilizing Catalytic Effects of TiO 2 on Polyurethane Matrix

Tateishi, Toru; Gao, Qi; Tani, Yasuhiro; Yanagihara, Kiyoshi; Sato, Hirotsugu

doi:10.1016/s0007-8506(07)60426-0

Cited by 17 publications

(4 citation statements)

References 3 publications

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“…And its wide range of abrasive can be added. In addition to silicon carbide (SiC), you can also use aluminum oxide (A12O3), cerium oxide (CeO2) and other abrasives [23].…”

Section: Fixed Abrasive Polishing Padmentioning

confidence: 99%

Status and Trends of Fixed Abrasive Polishing on Semiconductor

Zhao

Zuo

Sun

2012

KEM

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The necessity of fixed abrasive CMP in polishing semiconductor materials processing was analyzed. Compared the shortcomings of traditional free abrasive polishing with the advantages of fixed abrasive polishing, the applications of fixed abrasive polishing technology in semiconductor processing were described. A variety of fixed abrasive polishing pad production methods were introduced. The development trend of fixed abrasive polishing was prospected.

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“…And its wide range of abrasive can be added. In addition to silicon carbide (SiC), you can also use aluminum oxide (A12O3), cerium oxide (CeO2) and other abrasives [23].…”

Section: Fixed Abrasive Polishing Padmentioning

confidence: 99%

Status and Trends of Fixed Abrasive Polishing on Semiconductor

Zhao

Zuo

Sun

2012

KEM

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“…The experimental results showed that the glazed phenomenon of it was significantly improved due to the self-conditioning ability, and the material removal rate was increased by 30% than ordinary polishing pad. Tateishi et al (2006) fabricated the porous structure FAP through the addition of TiO 2 powder into it, and the CMP test was carried out with aluminum alloy material. It was found that the glazed phenomenon on the sample surface was effectively suppressed with this method.…”

Section: Introductionmentioning

confidence: 99%

Tribological glazing evolution of fixed abrasive pad under different polishing solution conditions

Tian,

Wu,

Pang

et al. 2023

ILT

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Purpose This study aims to clarify the influence mechanism of polishing solution type on the glazing evolution of fixed abrasive pad under different interfacial pressure conditions. Design/methodology/approach The tribological experiments were carried out on the friction and wear machinery with W3-5 diamond fixed abrasive pad and quartz glass workpiece under three polishing solution types of five pressure conditions. The changes of surface morphology, porosity and hardness of fixed abrasive pad were detected by white light interferometer, optical microscope and shore hardness tester. Findings The results showed that the glazed phenomenon of fixed abrasive pad is occurred after a certain time, which is more obvious with the increasing of interfacial pressures. The polishing solution type has a significant effect on the glazing time, although the glazed phenomenon is inevitable. The mechanism of it is that the micro-convex peaks on the surface of the fixed abrasive pad are easily wear, and the pores are blocked by the accumulation of waste debris generated during the experiment process. Thus, a smooth and high-density hard layer is formed on the surface of the fixed abrasive pad which induces the decreasing of the friction coefficient and surface roughness value. For selected polishing solution types, the wear rate of micro-convex peaks is different due to the corrosion action difference with polishing pad surface. Originality/value The main contribution of this work is to provide a new investigating method for further understanding the glazing evolution mechanism of fixed abrasive pad. Peer review The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-08-2023-0257/

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“…The abrasive grains are embedded in special resin in FA lapping or polishing, and only the abrasive protruding from the pad contact the work-piece to participate in the cutting process. The material removal for FA machining is based on a 2-body abrasion mechanism, with a high machining efficiency and an excellent planarization [6][7][8]. FA thermosetting resin pads were developed by 3M company for lapping and polishing of brittle materials such as glass, sapphire, ceramics and so on, which achieved a higher processing efficiency, but pad glazing phenomenon appeared [9].…”

Section: Introductionmentioning

confidence: 99%

Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad

Wang

Zhu

et al. 2018

KEM

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The choice of abrasive particle size is crucial to improve the lapping efficiency and surface quality in lapping of sapphire wafer by fixed abrasive (FA) pad. A model for the penetration depth of a single abrasive is developed with fixed abrasive pad. A serious of lapping tests were carried out using FA pads embedded with different size of diamond particles to verify the validity of the developed model. Results show that the penetration depth of abrasive is related not only to the particle size, but to the hardness ratio of the work-piece to the pad as well. The material removal rate of sapphire is proportional to the square of abrasive particle size, while the average surface roughness is proportional to the abrasive particle size.

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Development of a High-Porosity Fixed-Abrasive Pad Utilizing Catalytic Effects of TiO 2 on Polyurethane Matrix

Cited by 17 publications

References 3 publications

Status and Trends of Fixed Abrasive Polishing on Semiconductor

Status and Trends of Fixed Abrasive Polishing on Semiconductor

Tribological glazing evolution of fixed abrasive pad under different polishing solution conditions

Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad

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