Development of a low temperature PZT/polymer paste for screen printed flexible electronics applications

Almusallam, Ahmed; Yang, Kai; Zhu, Dibin; Torah, Russel; Tudor, John; Beeby, Steve

doi:10.1109/icsens.2014.6985472

Cited by 3 publications

(2 citation statements)

References 5 publications

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“…Poling helps to align the maximum Pockels coefficient tensor in the direction of the applied electric field to achieve maximum DC shift of the optical spectrum and reduce the V π L π parameter, both of which is a figure of merit in qualifying the electro-optic modulator. There have been reports on poling mechanism on bulk and thin film PZT [12,13,14]. Most of these reports have done a 1-dimensional poling.…”

Section: Introductionmentioning

confidence: 99%

3D poling and drive mechanism for high-speed PZT-on-SOI Electro-Optic modulator

Suraj

Selvaraja

2023

Cleo 2023

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Section: Introductionmentioning

confidence: 99%

3D poling and drive mechanism for high-speed PZT-on-SOI Electro-Optic modulator

Suraj

Selvaraja

2023

Cleo 2023

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“…Such composite materials have shown promise as electrical interconnects for their higher tolerance of applied strain when printed as inks onto polymer substrates [27]. Inclusions have ranged across Lead Zirconate Titanate (PZT) powders [28,29], carbon black [30,31], Carbon Nanotubes (CNTs) [32][33][34][35], and silver flakes [36,37], among others.…”

Section: Introductionmentioning

confidence: 99%

Electrical performance evolution and fatigue mechanisms of silver-filled polymer ink under uniaxial cyclic stretch

Cahn¹,

Pierron²,

Αντωνίου³

2021

Flex. Print. Electron.

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Flexible hybrid electronics rely upon compliant interconnects in order to maintain performance integrity in cases that require repeated elongation, including repeated stretching. A class of such conductive interconnects are composites of polymer with conductive particles that can be stretched at high strains without circuit failure. However, their fatigue response has so far remained largely unexplored and is essential prior to using in health monitoring applications. In this research, a stretchable silver-filled conductor is evaluated under high-strain cycling. In-situ techniques, including four-point resistance measurement and laser profilometry, are used to correlate changes in electrical performance to the fatigue response. Surface crack formation is extensive upon stretching during the first loading cycle, forming a heavily interconnected crack network at higher strains that does not immediately result in open circuit failure. Resistance increase with cycling is attributed to a gradual deepening of these cracks until their depths approach the film thickness, eventually leading to electrical failure. Fatigue life, the number of cycles required to reach a predetermined electrical performance limit, is shown to be most influenced by the applied strain amplitude. Using a normalized resistance increase limit of R/R 0 = 500, it is found that 500 µm wide conductive lines endure 23 cycles at 35% strain amplitude, but this becomes over 500 cycles when the amplitude is dropped to 5%. Sensitivity to mean strain, ε m , is relevant to strain amplitudes below 15%. In this manner, a composite conductor was shown to exhibit crack evolution behavior distinctly different from homogeneous metallic films.

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Stress-eliminated liquid-phase fabrication of colloidal films above the critical crack thickness

Liu,

Hong,

Hong

et al. 2024

Nat Commun

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The thickness of film materials is a critical factor influencing properties such as energy density, optical performance, and mechanical strength. However, the long-standing challenge of the intrinsic thermodynamic limit on maximum thickness often leads to detrimental cracking, compromising these desirable properties. In this study, we present an approach called the stress-eliminated liquid-phase fabrication (SELF) method. The SELF method eliminates the need for substrates to support the precursor solution used for film fabrication. We harness the intrinsic surface tension of the solution by confining it within specifically designed grids in a framework, forming suspended liquid bridges. This technique enables fabrication of crack-free ceramic films within a broad thickness range from 1 to 100 μm. Furthermore, the fabricated PZT films exhibit a high piezoelectric coefficient ( d 33 ) of 229 pC N −1 . The customizable grids not only offer design freedom for film topologies but also facilitate the fabrication of diverse film arrays without the need for destructive cutting processes. Moreover, the freestanding nature of these films enhances their adaptability for MEMS processing, and the “capillary bridge” topology allows the PZT films to be used in ultrasound focusing transmitter, providing possibilities in the medical imaging.

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Development of a low temperature PZT/polymer paste for screen printed flexible electronics applications

Cited by 3 publications

References 5 publications

3D poling and drive mechanism for high-speed PZT-on-SOI Electro-Optic modulator

3D poling and drive mechanism for high-speed PZT-on-SOI Electro-Optic modulator

Electrical performance evolution and fatigue mechanisms of silver-filled polymer ink under uniaxial cyclic stretch

Stress-eliminated liquid-phase fabrication of colloidal films above the critical crack thickness

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