Development of a mobile device for the evaluation of the current in‐situ stress condition in glass – Experimental and numerical analysis for bonded and mechanical joints

Abstract

Monitoring installation process and utilisation of glass and hybrid components in structural glass has become increasingly important. However, to date, there are no generally accepted standard procedures to evaluate the in‐situ stress condition of a built‐in glass. With the aid of photoelasticity a qualitative statement of the stress state in the glass can be made. For this reason, a measurement method and a functional model for a mobile device are being developed with which it is possible to measure in‐situ and identify stress peaks, for example, due to incorrect assembly of a glass fitting. By supporting finite element method (FEM) simulations it is possible to transfer the qualitative results of photoelastic measurements into quantitative results.