Development of a new electroplating solution for electrodeposition of Au–Co alloys

Chalumeau, L.; Wéry, M.; Ayedi, H.F.; Chabouni, M.M.; Leclère, C.

doi:10.1016/j.surfcoat.2006.02.004

Cited by 8 publications

(5 citation statements)

References 29 publications

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“…A variety of other gold alloys include gold-cobalt alloys deposited from a cyanide bath with an oxalate-citrate buffer and organic additives [57]. Gold-palladium alloys were deposited from an ionic liquid in the Lewis base form [58], and gold-silver was deposited from a cyanide bath by use of pulse plating [59].…”

Section: Gold Alloy Platingmentioning

confidence: 99%

Electrodeposition of Gold

Kohl¹

2010

Modern Electroplating

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While all that glitters may not be gold, it is the most beautiful of all the elements in their pure form. The name gold comes from the Old English Anglo-Saxon word for geolo meaning "yellow" while the symbol, Au, comes from the Latin word aurum, meaning "glowing dawn." Historically gold was one of the first metals known. Gold has been valuable throughout the ages chiefly because of its physical properties of softness, ductility, corrosion resistance, density, and scarcity. The first gold coin dates back to about 560 BC. Gold cups and jewelry predating 3500 BC have been found in Iraq. The ancient Egyptians knew how to hammer gold into leaf as thin as 66 nm. The importance of gold as a form of currency was at a high point in the 1900s when most countries were on the gold standard. The bullion price of gold over the past 21 years is shown in Figure 4.1.There have been about 160 metric kilotons of gold mined since it was first discovered, and it occupies about 0.005 ppm of the earth's crust. The world demand for gold in 2007 was approximately 80,000,000 troy ounces. Figure 4.2 shows the breakdown of the gold usage by industry. Jewelry comprises the largest fraction of the usage; however, much of that is not electroplated. For jewelry applications, gold is commonly alloyed with group IB or IIB metals, particularly copper, silver, platinum, and palladium, principally to improve its strength and wear resistance.The electrodeposition of gold is a relatively new process; it has been traced to the early work of Brugnatelli in 1805 [1]. The motives behind the use of electroplated gold changed dramatically in the mid-twentieth century when the emerging electronics industry required special-purpose electrical connections. The electronics industry consumed 5,330,000 troy ounces in 1994. Figure 4.3 shows the growth in the use of gold in the electronics industry by year. The use of electroplated gold in a variety of different functions in the electronics industry has led to (1) many advances in our fundamental understanding of the electrodeposition process and (2) new electroplating technologies over the past 25 years.Electrochemically deposited gold has satisfied many of the demands of the electronics industry. Gold has the third best electrical and thermal conductivity of all metals at room temperature. Also it has high ductility and excellent wear resistance, which are important for electrical contacts. The inertness of gold prevents the formation of insulating surface oxides (as compared to metals like aluminum). Group IIB metals (e.g., gold) are not good catalysts for other reactions, thus avoiding certain problems. For example, group IB metals (particularly platinum and palladium) can catalyze the polymerization of organic molecules forming insulating layers. In addition, gold is an excellent metal for wire bonding integrated circuits (ICs). Gold wires can be bonded to pure, soft gold pads by thermocompression bonding (300-400 C at high pressure to form a weld) or thermosonic bonding (150-200 C with ultrasonic energy to fo...

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Section: Gold Alloy Platingmentioning

confidence: 99%

Electrodeposition of Gold

Kohl¹

2010

Modern Electroplating

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“…Signals for CoO x was generated by the oxidation of deposited cobalt. 29 It means that there was some complex cobalt and CoO x entrained into the electrodeposit.…”

Section: Resultsmentioning

confidence: 99%

Cyanide-free electrolyte for Au/Co–Au nano-multilayer electrodeposition utilising 5,5-dimethylhydantoin as a complexing agent

Gong

Yuan

et al. 2022

RSC Adv.

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“…Au coatings are commonly used as contact materials to ensure stability and low contact resistance upon sliding contact in the electronics industry [1][2][3][4]. Soft Au which is not alloyed is one of the best metals with a high electrical conductivity, and it shows excellent corrosion resistance under most working conditions.…”

Section: Introductionmentioning

confidence: 99%

“…However, the low hardness of soft Au coatings leads to a low wear resistance and constrains their lifetime under applicable conditions involving intensive sliding movement [5]. In high-reliability systems, high-performance Au coatings are required, and alloying Au with a small amount of other metal elements, such as Co and Ni, can generate harder Au coatings which exhibit distinct performance improvement [1,[6][7][8]. Hard Au coatings are generally obtained from acidic-cyanide baths in which nickel or cobalt salts are added as the hardening/brightening agents [3,4,[9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Development and characterization of magnetron sputtered self-lubricating Au-Ni/a-C nano-composite coating on CuCrZr alloy substrate

Chen

Qiao

Hillairet

et al. 2019

Applied Surface Science

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Compounding Au-Ni with carbon (C) lubricants is a feasible approach to improve its mechanical properties and wear performance. In this study, 3.5 µm-thick Au-Ni/C nanocomposite coatings with a low residual stress on CuCrZr substrates by magnetron sputtering were developed. Face-centered cubic and hexagonal close-packed stacking structures were both confirmed in the composite coatings based on transmission electron microscopy and X-ray diffraction analyses. Amorphous C (a-C) was confirmed to be the structure of C in the composite coatings, and its graphitization transition with an increase in the C content was validated by X-ray photoemission spectra and Raman spectroscopy. By compounding 0.88 wt.% a-C, the hardness of the Au-Ni/a-C coating reached 400 HV, which is twice higher than that of the Au-Ni coating. The electrical resistivity of the Au-Ni/a-C coating is relatively stable with an increase in the a-C content. As graphitization occurred on the wear track, the produced composite coatings showed a minimum wear rate of 2.2×10-6 mm 3 /N·m under atmospheric conditions, which is half that of the Au-Ni reference coating. Under vacuum, the wear performance of the produced Au-Ni/a-C composite coatings was similar to that of the Au-Ni reference coating.

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Development of a new electroplating solution for electrodeposition of Au–Co alloys

Cited by 8 publications

References 29 publications

Electrodeposition of Gold

Electrodeposition of Gold

Cyanide-free electrolyte for Au/Co–Au nano-multilayer electrodeposition utilising 5,5-dimethylhydantoin as a complexing agent

Development and characterization of magnetron sputtered self-lubricating Au-Ni/a-C nano-composite coating on CuCrZr alloy substrate

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