Development of Adhesive Wafer Bonding Technology

Geomorphometry and microelectronic metrology: Converged realms

“…For example, in contact lithography, element formation requires the use of wafers with a flat surface. In technologies of three-dimensional integrated circuits, there is a need to evaluate the shape and deflection of wafers in bonding operations (Fomichev et al, 2021). Second, the determination of a wafer/structure surface curvature is often conducted to estimate their mechanical stresses (Shinohara et al, 2018).…”