Development of Boric Acid Free High Speed Electro Nickel Plating Bath

Abstract

For the field of nickel electroforming, where thickness of about 100-500 μm is obtained at the current density of 20-50 A/dm 2 , increase in the current density is demanded for higher plating speed. Regarding the environmental impact, a plating bath without boric acid is also in demand.Results obtained from studying various organic acids to replace boric acid show that acetic acid facilitates high-speed plating without burning at a current density of up to 200 A/dm 2 . The effect of acetic acid was attributed to its excellent buffering capability.