2013 IEEE 63rd Electronic Components and Technology Conference 2013
DOI: 10.1109/ectc.2013.6575826
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Development of double-sided with double-chip stacking structure using panel level embedded wafer level packaging

Abstract: In recent years, consumer electronics demand has been geared towards lightweight, high capacity, and high efficiency small form factor devices. These characteristics can be achieved by using three-dimensional (3D) integrated circuit (IC) technology. This study proposes a double-chip stacking structure in an embedded fan-out wafer level packaging (WLP) with double-sided interconnections. This structure consists of two or more thin dies, chip carriers, through mold vias (TMV), and interconnection structures. The… Show more

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