2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00018
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Development of Embedded Glass Wafer Fan-Out Package With 2D Antenna Arrays for 77GHz Millimeter-wave Chip

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Cited by 3 publications
(2 citation statements)
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“…Since the embedded ICs are integrated face-up into the glass panel along with the flip-chip ICs on top of the RDL, ultra-short and ultra-dense interconnects across chiplets can be realized without reverting to use inefficient TSVs [20]. The very favorable mechanical and electrical characteristics of the polymer-enhanced GPE technology has also led to multifaceted developments of mm-wave antenna-integrated packages [83], [84], [26]. A 28-GHz antenna-integrated package for 5G communications was demonstrated in [85].…”
Section: Packaging and Interposer Solutionsmentioning
confidence: 99%
See 1 more Smart Citation
“…Since the embedded ICs are integrated face-up into the glass panel along with the flip-chip ICs on top of the RDL, ultra-short and ultra-dense interconnects across chiplets can be realized without reverting to use inefficient TSVs [20]. The very favorable mechanical and electrical characteristics of the polymer-enhanced GPE technology has also led to multifaceted developments of mm-wave antenna-integrated packages [83], [84], [26]. A 28-GHz antenna-integrated package for 5G communications was demonstrated in [85].…”
Section: Packaging and Interposer Solutionsmentioning
confidence: 99%
“…Fig. 5(f) provides an example of a glass-embedded package composed of a conventional RDL to form the fan-out area and a molding compound on top of the glass core for the antenna elements [84]. The ability to process thicker dielectrics for the radiating elements at 77 GHz helps to meet bandwidth and efficiency requirements.…”
Section: Packaging and Interposer Solutionsmentioning
confidence: 99%