2012 24th International Symposium on Power Semiconductor Devices and ICs 2012
DOI: 10.1109/ispsd.2012.6229077
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Development of high-reliability thick Al-Mg<inf>2</inf>Si wire bonds for high-power modules

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Cited by 5 publications
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“…Therefore, the use of copper wires cladded with aluminium (an example for this is shown in Figure 10 for ribbon bond wires) allows the use of standard chip contacts while increasing the lifetime of the bond wires [31], [32]. Also, research on other materials, usually alloys of aluminium, as a replacement to aluminium have shown promising results [33], [34]. Ribbon Bonding -This technique makes use of rectangular ribbons of bond wire ( Fig.…”
Section: A Component Reliability -Power Module Levelmentioning
confidence: 99%
“…Therefore, the use of copper wires cladded with aluminium (an example for this is shown in Figure 10 for ribbon bond wires) allows the use of standard chip contacts while increasing the lifetime of the bond wires [31], [32]. Also, research on other materials, usually alloys of aluminium, as a replacement to aluminium have shown promising results [33], [34]. Ribbon Bonding -This technique makes use of rectangular ribbons of bond wire ( Fig.…”
Section: A Component Reliability -Power Module Levelmentioning
confidence: 99%