Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy

Abstract

This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.

A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

“…With the increase in the alloy Sb content, the extensive formation of the intermetallic phase has been considered to have possible deleterious effect on the mechanical properties, mainly when the maximum solubility of Sb in Sn is reached, i.e. about 10 wt.% Sb [1,27,28]. Although some of the studies on Sn-Sb alloys existing in the literature emphasize mechanical properties, the literature is still scarce on correlations of such properties with microstructure features obtained under transient solidification conditions, which are also typical of soldering processes.…”