A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Dias, M.V.B.; Costa, Thiago A.; Silva, Bismarck Luiz; Spinelli, José Eduardo; Cheung, Noé; Garcia, Amauri

doi:10.1016/j.microrel.2017.12.029

Cited by 30 publications

(20 citation statements)

References 37 publications

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“…These initiatives provide a good opportunity for the development of new lead-free solder. Hence Sn-base lead-free solders, including Sn-Ag [8], Sn-Bi [9], Sn-Cu [10], Sn-In [11], Sn-Sb [12] and Sn-Zn [13] have become the potential candidates for Sn-Pb solder replacement.…”

Section: Introductionmentioning

confidence: 99%

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/ solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. This figure presents the interface morphology of Sn-Cu-Ni-xPr joint. (a) x = 0, (b) x = 0.05wt%. It was clear that with the addition of 0.05% Pr, the thickness of IMC layer decreases significantly and the formation of voids at the interface is inhibited.

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Section: Introductionmentioning

confidence: 99%

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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“…This gives an acceptable explanation of why although λ 1 and λ 2 are finer at regions closer to the cooled bottom of the Bi-20 wt% Sb alloy casting, the HV values are lower as compared with those of positions toward the top of the DS casting. Although hardness can be considered an important characteristic for TIM applications, further tests involving other important properties are necessary such as tensile properties, [64] wettability of the alloy against different substrates, [65] and the corresponding thermal interface resistance. [66]…”

Section: Resultsmentioning

confidence: 99%

Microstructure Growth Morphologies, Macrosegregation, and Microhardness in Bi–Sb Thermal Interface Alloys

et al. 2020

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Due to the rising demand for thermal management technologies within the electronics industry, there has been an increased emphasis on developing new thermal interface materials (TIMs) with enhanced performance. Despite Bi‐based alloys having exhibited promising potential as TIMs in microelectronics cooling applications, understanding the microstructure evolution of these alloys and the consequent effects on the resulting properties still remains an essential task to be accomplished. Herein, a directional solidification technique is used to investigate microstructural features and Vickers microhardness of Bi(5–20) wt% Sb alloys with a focus on the roles of alloy composition, solidification thermal parameters, and macrosegregation. The results show the formation of aligned Bi‐rich dendrites in a broad range of cooling rates from about 0.2 to 25 °C s−1. In contrast, as the alloy Sb content increases, two morphological transitions in the Bi‐rich matrix are shown to occur as follows: trigonal pattern → irregular shape → trigonal pattern. Then, primary and secondary dendritic arm spacings are related to growth and cooling rates through experimental equations. Finally, the occurrence of macrosegregation along the length of the Bi–20 wt% Sb alloy casting is shown to be a key factor associated with the variation of microhardness.

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“…Many dislocations are generated in the crystal due to the application of pressure, resulting in the increase of lattice strain and the decrease of grain size. Dias et al [40] found that the microstructure of Sn-10Sb solder was honeycomb b-Sn and Sn 3 Sb 2 IMC in the cooling range of 2.5-25 K/s, and the gains spacing increased with the decrease of cooling rate.…”

Section: Sn-sbmentioning

confidence: 99%

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Wang

Zhang

2021

J Mater Sci: Mater Electron

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Electronic devices need to work at high temperature in some fields for a long time, peculiarly step soldering technology, primary packaging and flip-chip connections, etc., along with the application of electronic products more and more widely. These phenomena promote the further development of hightemperature solders. Because of the high melting temperatures of Sn-Ag and Sn-Sb, they are suitable for high-temperature fields such as automotive electronics and avionics. In this review, the influences of trace elements and nanoparticles on microstructure, intermetallic components (IMC) growth, mechanical properties, wettability, melting behavior, and creep behavior of Sn-Ag and Sn-Sb solders have been summarized systematically. It was found that the addition of trace elements or nanoparticles into solders to be beneficial in improving the performance of Sn-Ag and Sn-Sb solders. Besides, the melting behavior of the solder at high temperatures can be further improved if Sn-Ag and Sn-Sb are used better as high-temperature solders.

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A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Cited by 30 publications

References 37 publications

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Microstructure Growth Morphologies, Macrosegregation, and Microhardness in Bi–Sb Thermal Interface Alloys

Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

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