Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao, Meng; Liu, Zhi-Quan; Xiong, Ming-yue; Sun, Lei

doi:10.1080/14686996.2019.1591168

Cited by 98 publications

(37 citation statements)

References 110 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Sn-Ag-Cu solder is the best substitution in the replace of Sn-Pb solder. However, with the miniaturization of electron components and deterioration of the service environment, the higher requirements are put forward for the comprehensive properties of SAC solders [62][63][64]. Therefore, lots of measures had been carried out to enhance the comprehensive performance of SAC solders.…”

Section: Evolution Of Microstructure and Propertiesmentioning

confidence: 99%

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Wang

Liu

et al. 2020

Journal of Nanomaterials

View full text Add to dashboard Cite

With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.

show abstract

Section: Evolution Of Microstructure and Propertiesmentioning

confidence: 99%

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Wang

Liu

et al. 2020

Journal of Nanomaterials

View full text Add to dashboard Cite

show abstract

“…The commonly used solder alloy in electronic manufacturing was the tin-lead (Sn63wt.%-Pb37wt.%) because of its good wettability, low melting temperature, availability, etc. [7]. However, lead (Pb) has been restricted for further use in electronic components due to the low electronics' recycling rate and the adverse impact of Pb on human health [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature

Ali

Khan²,

Aamir

et al. 2021

Metals

View full text Add to dashboard Cite

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the problems associated with the growth formation of intermetallic compounds need further research, especially at high temperatures. This study investigates the doping of Bismuth into SAC305 in the various compositions of 1, 2, and 3 wt.%. The microstructure in terms of intermetallic compound particles and mechanical properties was examined after thermal aging at temperatures of 100 °C and 200 °C for 60 h. The microstructure examination was observed using scanning electron microscopy, and the chemical composition of each alloy was confirmed with an energy dispersive X-ray. Tensile tests were performed to find the mechanical properties such as yield strength and ultimate tensile strength. The intermetallic compound’s phase analysis was identified using X-ray diffraction, and differential scanning calorimetry was done to study the temperature curves for melting points. Results showed that the addition of Bismuth refined the microstructure by suppressing the growth of intermetallic compounds, which subsequently improved the mechanical properties. The thermal aging made the microstructure coarsen and degraded the mechanical properties. However, the most improved performance was observed with a Bismuth addition of 3 wt.% into SAC305. Furthermore, a decrease in the melting temperature was observed, especially at Bismuth compositions of 3 wt.%.

show abstract

“…Meng Zhao et. al [11] have improved the Sn-Cu lead-free solders performance by alloying, particle strengthening, optimization of the soldering process, and development of matching soldering fluxes. They confirmed on the essentiality to understand the structureperformance relationships and potential reliability problems of Sn-Cu solders.…”

Section: Introductionmentioning

confidence: 99%

Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications

Alsowidy

Aljarbani

Gumaan

2021

Preprint

View full text Add to dashboard Cite

The microstructural, creep resistance and electrical conductivity properties of Sn-0.7Cu eutectic alloy with Bi-additions in concentrations (0.3 and 0.5 wt.%) have been investigated using x-ray diffraction (XRD), Scanning electron microscope (SEM), creep testing machine and (DC) circuit respectively. The three samples were prepared from high purity (99.99%) elements Sn, Cu, and Bi using melting technique. XRD and SEM analysis showed that the eutectic Sn-0.7Cu alloy composed primarily of two phases; a body centered tetragonal 𝜷-Sn phase and monoclinic IMC Cu 6 Sn 5 , the additions of 0.3 and 0.5 wt.% Bi to the eutectic Sn-0.7Cu promote the formation of IMC Cu 6 Sn 5. The above motioned Bi additions have refined the 𝜷-Sn particle size. Creep tests showed that the creep strain rate increases and the creep lifetime (rupture time) decreases as the applied stress and temperature rises. Improvements in creep resistance solders have been achieved by increasing the Bi content up to 0.5 wt. %. The mean values of stress exponent and activation energy indicate that the dislocation creep is the dominate controlling mechanism. The electrical conductivity of the samples was calculated at room temperature, it has the highest value with 0.3 wt.% of Bi.

show abstract

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Cited by 98 publications

References 110 publications

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature

Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications

Contact Info

Product

Resources

About