Development of Metal-Supported Proton-Conducting Solid Oxide Cells Via Co-Sintering

Abstract

Metal-supported solid oxide cells with P434L stainless steel support and BZCYYb-4411 electrode backbone and electrolyte layers are fabricated. Sintering aids for the ceramic layer are optimized. LiF is found to lower the ceramic sintering temperature too much. Manganese oxide enhances sintering and densification without dramatically reducing the sintering onset temperature. The impact of metal particle size on sintering is assessed. A symmetric structure helps to prevent warping or cracking arising from residual mis-match between the metal and ceramic sintering shrinkage. Intact cell structures are successfully prepared with <15 μm stainless steel particles and 2 wt% manganese oxide added to the BZCYYb-4411 layers.

Protonic ceramic electrochemical cells in a metal supported architecture: challenges, status and prospects

“…Depending on the processing routes, which will be discussed in the following, the electrolyte thickness could be significantly reduced in MSCs that will benefit the mitigation of ohmic loss. Apart from the MSC structure shown in figure 2, symmetric design with two porous metal support is also proposed that would help to prevent warping or cracking arising from residual mismatch between the metal and ceramic sintering shrinkage [24].…”

“…The symmetric cell architecture developed and investigated at LBNL includes thin ceramic electrolyte and scaffold backbone layers co-sintered between ferritic steel supports. The architecture is attractive that could prevent warping or cracking due to residual mis-match between the materials [24]. Another benefit of the symmetric structure is that the electrolyte layer is not directly exposed to the flowing reducing atmosphere in the sintering furnace.…”

“…In contrast, the portion of the electrode near the highly porous metal support loses a significant amount of Ba. For the co-sintering process, improved shrinkage matching between BZCYYb and metal support is needed to minimize stress in the ceramic layer [24].…”