2019
DOI: 10.1016/j.solener.2019.07.055
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Development of nanoparticle copper screen printing pastes for silicon heterojunction solar cells

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Cited by 29 publications
(12 citation statements)
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“…The copper powder, glass powder, and silver powder are taken as examples to prove that the pastes obtained from the organic medium with excellent performance also have outstanding properties. , The photograph and surface morphology of copper powder are shown in Figure a,b. The particle size of copper powder is 2–4 μm.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The copper powder, glass powder, and silver powder are taken as examples to prove that the pastes obtained from the organic medium with excellent performance also have outstanding properties. , The photograph and surface morphology of copper powder are shown in Figure a,b. The particle size of copper powder is 2–4 μm.…”
Section: Resultsmentioning
confidence: 99%
“…studied the influence of ethyl cellulose content on the rheological performance of the ceramic pastes, ultimately reflecting in the result of screen printing. Studies performed by Xu et al studied the relationship between the rheological performance of solder paste and the printing properties. , Meanwhile, Bukat et al reported how the content of silver nanoparticles affects the wettability between the Sn–Ag–Cu solder pastes and the copper matrix. Mbokou et al studied the hydrophobic character of the electrode surface by the contact angle measurements.…”
Section: Introductionmentioning
confidence: 99%
“…[103,104,153] The application of screen-printable copper paste on solar cells has been studied as it can be easily applied to established cell production lines. Copper paste for low-temperature curing has been researched as a promising product by some groups such as Dow Corning, AIST Japan, Samsung, et al [154,155] The main issues of developing copper paste are the prevention of copper oxidation during annealing and the diffusion into the silicon substrate. Copper paste applications in SHJ solar cells have higher potential because the TCO layer acts as a diffusion barrier for copper at low curing temperatures.…”
Section: Low Cost Metal Electrodesmentioning
confidence: 99%
“…Nozzle-based printing assembly is based on inkjet printing, which is a non-contact, high-resolution, maskless NP patterning technology. 21 , 22 Template-based printing assembly is mainly based on screen printing, 23 , 24 nanoimprinting (NIL), 25 , 26 , 27 microcontact printing (μCP), 28 , 29 and evaporative lithography printing 30 , 31 for low-cost and large-scale manufacturing. This section comprehensively discusses the principles and mechanisms of these printing assembly methods.…”
Section: Introductionmentioning
confidence: 99%