2011
DOI: 10.7567/jjap.50.05ec09
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Development of Original End Point Detection System Utilizing Eddy Current Variation Due to Skin Effect in Chemical Mechanical Polishing

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Cited by 6 publications
(4 citation statements)
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“…The need for such measurements requires the fitting of the polisher with costly friction plates (which are quite large and complex, and may not always be suitable for certain types of polishers), force sensors, multiplexers and signal amplifiers all of which need periodic calibrations. The scientific literature is filled with alternate methods [16][17][18][19][20][21][22][23][24][25][26][27][28][29][30] of inferring COF in CMP with the most popular of such approaches being centered around measuring platen motor current (PMC). During CMP, the wafer and the platen corotate at desired angular velocity setpoints.…”
Section: Introductionmentioning
confidence: 99%
“…The need for such measurements requires the fitting of the polisher with costly friction plates (which are quite large and complex, and may not always be suitable for certain types of polishers), force sensors, multiplexers and signal amplifiers all of which need periodic calibrations. The scientific literature is filled with alternate methods [16][17][18][19][20][21][22][23][24][25][26][27][28][29][30] of inferring COF in CMP with the most popular of such approaches being centered around measuring platen motor current (PMC). During CMP, the wafer and the platen corotate at desired angular velocity setpoints.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, there are many alternate methods of inferring frictional effects in CMP that have been reported on in the scientific literature. [24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39] The most popular of such methods measures the carrier or the platen motor current (CMC or PMC). [40][41][42][43][44][45][46][47][48][49][50][51][52][53][54] During polishings, both wafer and platen rotate at desired velocity setpoints.…”
mentioning
confidence: 99%
“…Such measurements necessitate that the CMP polisher be fitted with costly friction plates (that are quite large and complex and may not always be suitable for certain types of polishers), force sensors, multiplexers and signal amplifiers. The scientific literature is also ripe with alternate methods of inferring the magnitude of frictional effects in CMP such as temperature, [5][6][7][8][9][10] eddy current, 24,25 vibration, [26][27][28] and end-point detection means by capacitance, electrical resistance, infrared interferometry, slurry constituent analysis, and ultrasonic sensing. [29][30][31][32][33][34][35][36][37][38][39] The most popular of such alternate methods is centered around measuring the carrier, or the platen, motor current (CMC, or PMC).…”
mentioning
confidence: 99%