2015
DOI: 10.1109/tcad.2015.2446939
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DFT Architecture With Power-Distribution-Network Consideration for Delay-Based Power Gating Test

Abstract: obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.The WestminsterResearch online digital archive at the University of Westminster aims to make the research output of the University available to a wider audience. Copyright and Moral Rights remain with the authors and/o… Show more

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Cited by 5 publications
(7 citation statements)
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“…Logic gates are sized in order to be symmetric for the worst case delay. The V V dd network is modeled with a lumped RC circuit, whose parameters have been derived from [26]: R V V dd = 1Ω, C V V dd = 5f F for the b02 benchmark, C V V dd = 7f F for the NOT chain. Note that the NOT chain (composed by 10 FO4 inverters) is larger than the b02 benchmark and this area difference is reflected by the different values of the parasitic capacitance associated to the V V dd power network in the two case studies.…”
Section: A Simulation Set-upmentioning
confidence: 99%
“…Logic gates are sized in order to be symmetric for the worst case delay. The V V dd network is modeled with a lumped RC circuit, whose parameters have been derived from [26]: R V V dd = 1Ω, C V V dd = 5f F for the b02 benchmark, C V V dd = 7f F for the NOT chain. Note that the NOT chain (composed by 10 FO4 inverters) is larger than the b02 benchmark and this area difference is reflected by the different values of the parasitic capacitance associated to the V V dd power network in the two case studies.…”
Section: A Simulation Set-upmentioning
confidence: 99%
“…The proposed method does not stress the chip during the collection of the signature and the temperature variability is expected to be low. However, if temperature sensors are available during the signature collection and systematic temperature-induced variability is observed, then a similar approach as in [3] can be adopted for higher accuracy.…”
Section: Robustness Of the Sensor Against Process Variationmentioning
confidence: 99%
“…Power-gating, which is implemented using either header power switches (pMOS sleep transistors) on the supply power rail V dd or footer power switches (nMOS sleep transistors) on the ground power rail V ss of the power-gated block, has been targeted by testing and diagnosis techniques before [3]- [11]. These techniques target the stuck-open transistor fault model on the power switches that are utilized for disconnecting the virtual supply rail V V dd or the virtual ground rail V V ss , respectively, during stand-by.…”
Section: Introductionmentioning
confidence: 99%
“…3, is a very small circuit that resides in the power-gating controller and operates as a timeto-digital converter. This type of sensors is already used by power gating DFT infrastructure [30]. The power gating FSM controls the sensor by asserting the measure signal together with the sleep signal in order to collect the d V measurement on every standby operation.…”
Section: A Discharge Time Sensormentioning
confidence: 99%
“…The discharge time sensor (Section III-A) consists of only a logic AND gate, an inverter, and a clock cycles counter. This type of delay sensor may already be part of the power gating DFT infrastructure [30], [36]. The maximum number of bits |CC| for the counter was |CC| = log 2 (d V (t = 10, T A = 120, T M = 60)/T clk ) = 14 bits, and is obtained with an operating clock period T clk = 1 ns and the maximum d V value that is observed (after time t = 10 years, with average temperature T A = 120°C and temperature during stand-by T M = 60°C) (lower temperature considered) and operating clock period T clk = 1 ns.…”
Section: E Area Cost and System Memory Requirementsmentioning
confidence: 99%