Diamond Turning of Soft Semiconductors to Obtain Nanometric Mirror Surfaces

Fang, Fengzhou; Venkatesh, V.C.; Zhang, G. X.

doi:10.1007/s001700200107

Cited by 31 publications

(9 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As such, possible phase transformation events during machining are of great significance in the production of damagefree components. [2][3][4][5][6][7][8][9][10] Zero-rake-angle cutting of brittle materials In conventional machining, the cutting-edge radius of carbide tools can be considered sharp, as the radius is substantially smaller than the undeformed chip thickness. But in the ultraprecision machining of brittle materials, the cutting edge radius is larger than the undeformed chip thickness.…”

Section: Increasing the Rate Of Absorbed Energy In Nanoindentationmentioning

confidence: 99%

Advances in micro/nanomachining improve production of thin, brittle wafers

Fang

2006

SPIE Newsroom

Self Cite

View full text Add to dashboard Cite

By cutting brittle materials when they can bend as they break, monocrystalline silicon wafers can be produced more easily. Many materials, including silicon wafers, are naturally brittle. Traditional machining of these materials produces a damaged layer that must be polished chemically. But micromachining of brittle materials is possible if one provides enough compressive stress to cause a ductile mode of fracture (where the material deforms) in which material is removed by plastic extrusion. Suppression of a brittle response when cutting on the nanometer scale helps avoid the generation of surface defects. The cutting process must be carefully studied to operate in the ductile regime, however. The cutting geometry and machining rates are the usual focus, but indentation is also used to study the brittleto-ductile transition. This article discusses some recent achievements in the micro/nanomachining of brittle materials.

show abstract

Section: Increasing the Rate Of Absorbed Energy In Nanoindentationmentioning

confidence: 99%

Advances in micro/nanomachining improve production of thin, brittle wafers

Fang

2006

SPIE Newsroom

Self Cite

View full text Add to dashboard Cite

show abstract

“…When the cutting edge radius is larger than the undeformed chip thickness in ultra-precision machining of brittle materials, even though the actual rake angle is 0 • , the effective rake angle γ e is a large negative value. Figure 9 shows that the effective rake angle varies with the tool edge radii and undeformed chip thickness (Fang et al 2002).…”

Section: Surface Generationmentioning

confidence: 99%

Micro-machining of optical glasses — A review of diamond-cutting glasses

Liu

Lee

2003

Sadhana

Self Cite

View full text Add to dashboard Cite

In order to diamond-turn optical glasses to a nanometric surface finish, it is critical to determine the transition point from brittle mode to ductile mode. This paper presents various experimental techniques to study this transition and discusses the mechanism of the surface generation. It has been recognized that tool wear is a serious issue in diamond turning of glasses. Thus, research in future should be concentrated on this field to enable the technology to be applied in commercial production.

show abstract

“…Natural single crystal diamond has been widely used in ultra-precision machining of nonferrous metals owing to its outstanding mechanical and physicochemical properties [1,2]. However, cutting of ferrous metals with diamond tools has not been successful in application to date as the tool wear rate is severe [3,4].…”

Section: Introductionmentioning

confidence: 99%

Thermochemical Wear of Single Crystal Diamond Catalyzed by Ferrous Materials at Elevated Temperature

et al. 2017

View full text Add to dashboard Cite

Abstract:Single crystal diamond has been recognized as the optimal tool material in ultra-precision machining. However, the excessive tool wear prevents it from cutting ferrous materials. This paper conducts a series of thermal analysis tests under the conditions of different gas atmospheres, heating temperatures, crystallographic planes and workpiece materials, in order to clarify the details of thermochemical wear of diamond catalyzed by iron at elevated temperature. Raman scattering analysis was performed to identify the transformation of diamond crystal structure. Energy dispersive X-ray analysis was used to detect the change in chemical composition of the work material. X-ray photoelectron spectroscopy was adopted to confirm the resultants of interfacial thermochemical reactions. The experimental results revealed that the diamond wear included the graphitization, diffusion and oxidation. Temperature was considered as the key factor affecting these wear mechanisms. The initial graphitization temperatures of diamond catalyzed by iron under different conditions were obtained, and the graphitized degree relied heavily on the crystallographic plane while being insensitive to the workpiece material. The diffusion wear rule was preliminarily achieved by the established prediction model of the carbon atoms diffusing into the iron lattice, and the types and resultants of interfacial chemical reactions were deduced.

show abstract

Diamond Turning of Soft Semiconductors to Obtain Nanometric Mirror Surfaces

Cited by 31 publications

References 8 publications

Advances in micro/nanomachining improve production of thin, brittle wafers

Advances in micro/nanomachining improve production of thin, brittle wafers

Micro-machining of optical glasses — A review of diamond-cutting glasses

Thermochemical Wear of Single Crystal Diamond Catalyzed by Ferrous Materials at Elevated Temperature

Contact Info

Product

Resources

About