2017 Ieee Sensors 2017
DOI: 10.1109/icsens.2017.8234393
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Diamond/ZnO/LiNbO3 structure for packageless acoustic wave sensors

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Cited by 2 publications
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“…In this configuration, the inter‐digital transducers (IDTs) are deposited on the LiNbO 3 substrate; AlN and LiNbO 3 have a high acoustic velocity compared to ZnO; and LiNbO 3 is characterized by a high electromechanical coupling coefficient and weak acoustic wave propagation losses . Recently, it was shown that the use of a sputtered AlN film of 6 μm thickness causes acoustic losses during propagation, while theoretical calculations pointed out that using only 2.5 μm of diamond films would be sufficient to confine the wave and to reduce the propagation losses . Moreover, the wave confinement should be improved with the diamond layer.…”
Section: Introductionmentioning
confidence: 99%
“…In this configuration, the inter‐digital transducers (IDTs) are deposited on the LiNbO 3 substrate; AlN and LiNbO 3 have a high acoustic velocity compared to ZnO; and LiNbO 3 is characterized by a high electromechanical coupling coefficient and weak acoustic wave propagation losses . Recently, it was shown that the use of a sputtered AlN film of 6 μm thickness causes acoustic losses during propagation, while theoretical calculations pointed out that using only 2.5 μm of diamond films would be sufficient to confine the wave and to reduce the propagation losses . Moreover, the wave confinement should be improved with the diamond layer.…”
Section: Introductionmentioning
confidence: 99%
“…Diamond, which is harder than AlN may then be considered for the upper layer [21]. Comparison between the two structures AlN/ZnO/LiNbO3 and Diamond/ZnO/LiNbO3 are in progress [22]. In order to obtain low-profile sensors, the manufacturing of SAW devices on thinned substrates is also interesting.…”
Section: Discussionmentioning
confidence: 99%