Diatomite‐filled epoxy resin composites: Curing behavior, dielectric, and thermal properties

Zhou, Yuan; Wang, Zhicheng; Guo, Zihao; Wang, Yanhui; Wang, Jun; Liu, Wenbin; Derradji, Mehdi; Qiu, Jian

doi:10.1002/pc.26386

Cited by 16 publications

(5 citation statements)

References 50 publications

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“…A small amount of oxygen was carried into the pores of diatomite, thus promoting the oxidative decomposition of the composite. The addition of PEI‐KH560‐DE reduced the maximum thermal weight loss rate and slowed down the thermal decomposition of the epoxy resin 39 . Moreover, the addition of raw‐DE and PEI‐KH560‐DE substantially increased the char yield of the epoxy resin system at 600°C.…”

Section: Resultsmentioning

confidence: 99%

“…The addition of PEI-KH560-DE reduced the maximum thermal weight loss rate and slowed down the thermal decomposition of the epoxy resin. 39 Moreover, the addition of raw-DE and PEI-KH560-DE substantially increased the char yield of the epoxy resin system at 600 C. In comparison with the 14.10 wt% char yield of pure epoxy resin at 600 C, the char yield of PEI-KH560-DE/EP composite reached 25.30 wt%, corresponding to a 79.43% increase in char yield. PEI-KH560-DE enhanced the heat resistance and thermal stability of the epoxy resin.…”

Section: Thermal Performance Testing and Curing Kinetics Of Epoxy Res...mentioning

confidence: 92%

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Modification mechanism of modified diatomite with flexible amine‐based structure as a filler of epoxy resin and mechanical properties and curing kinetic of composites

Wang,

Lou,

et al. 2023

Polymer Composites

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In this study, the binding of amine‐based hyperbranched macromolecular polyethyleneimine (PEI) to diatomite (DE) was carried out by using the silane coupling agent KH560 (PEI‐KH560‐DE). Fourier infrared spectroscopy, scanning electron microscopy were used to characterize the structure of the modified DE. Then, the composites were prepared using PEI‐KH560‐DE as the filler in the epoxy resin matrix and then cured with dimethylimidazole. The cured composites were tested for impact resistance, flexural properties, and tensile properties, and then subjected to DSC. The experimental results showed that when different proportions of diatomite or modified diatomite were added to the epoxy resin matrix, the strength and toughness of the composites could be significantly enhanced. When the content of PEI‐KH560‐DE was 15 wt%, the impact strength of the composites reached the maximum value of 5.39 kJ/m2, which was 156.67% higher than that of the pure epoxy resin (2.10 kJ/m2). The tensile strength was also improved from 16.38 MPa of the pure epoxy resin to 26.55 MPa, corresponding to an increase of 62.09%. With the addition of modified diatomite, the Tdmax and char yield of the composites were significantly enhanced, indicating that the addition of diatomite can enhance the heat resistance and thermal stability of the composites. The curing kinetics study showed that the addition of PEI‐KH560‐DE can significantly reduce the apparent activation energy required for the curing reaction of epoxy resin probably due to the presence of amine group in PEI, which plays a role in promoting the curing behavior.Highlights Amine groups and flexible chain segments were introduced into diatomite. Mechanism of polyethyleneimine‐modified diatomite was investigated. Improved mechanical and thermal properties of PEI‐KH560‐DE/EP composites. Curing kinetics showed that amine groups reduce apparent activation energy.

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Section: Resultsmentioning

confidence: 99%

Section: Thermal Performance Testing and Curing Kinetics Of Epoxy Res...mentioning

confidence: 92%

Modification mechanism of modified diatomite with flexible amine‐based structure as a filler of epoxy resin and mechanical properties and curing kinetic of composites

Wang,

Lou,

et al. 2023

Polymer Composites

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“…The evaluation encompassed measurements of the storage modulus in MPa, providing insights into material stiffness, as well as the Tan (δ), which quantifies the correlation between stored elastic energy and energy dissipated per vibration cycle. [35][36][37] The thermomechanical attributes of these composites are contingent on diverse parameters, encompassing the nature and quantity of the reinforcing phase. Consequently, alterations in these conditions lead to distinct values for the modulus and glass transition temperature (Tg).…”

Section: Dynamic Mechanical Analysismentioning

confidence: 99%

Enhancing electromagnetic absorption in microwave of epoxy resin through incorporated surface modified aluminum oxide nanoparticles

Medjaouri,

Ales,

Mehelli

et al. 2023

High Performance Polymers

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The development of novel nanomaterials with superior reflection loss (RL), thin thickness, wide bandwidth, and low density has recently received significant attention in an effort to increase their effectiveness in electromagnetic (EM) microwave absorption while maintaining an easy manufacturing process. Naturally, using conventional materials with magnetic or dielectric loss makes it difficult to achieve the last criterion and limitations the thickness of the absorber and mass production. In this work, microwave nanocomposites samples were prepared on epoxy resin with different percentages of the nanoparticles of aluminum oxide (epoxy/Al2O3) with surfaces treated by amino propyl and silane. The surface treatment was carried out to improve the adhesion, morphology, and EM properties of the samples to enhance the microwave absorption and the Shielding Effectiveness (SE). Therefore, the treated sample can be considered as potential candidate for high frequency EM absorption applications. Then, the study is followed by structural, morphological, thermal, and electrical characterization of the prepared samples in order to enhance the performances of the latters. The EM absorption and the shielding effectiveness were done in the X band frequency (8 GHz-12 GHz). The obtained results confirmed that the nanocomposites treated samples exhibit higher EM absorption performance and better electrical characteristics. Overall, these results put forward the role played by the addition of the nanoparticles films as high-performance materials in electronic devices and EM applications.

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“…The results showed that the incorporation of diatomite could dramatically improve the mechanical and thermal stability of the epoxy composites. Yuan et al 34 mixed a novel curing agent consisting of acrylic acid and 4,4 0 -(hexafluoroisopropylidene) bis(p-phenyleneoxy)dianiline with different contents of diatomite (CP) particles and added them to epoxy resin (E51), prepared biobased composites that could be rapidly molded and cured at room temperature. The effects of the amount of CP particles on the mechanical (tensile, flexural, and impact) and thermal properties of the composites were discussed.…”

Section: Introductionmentioning

confidence: 99%

The effects of the contents of modified‐diatomite on the properties of modified‐diatomite/epoxy resin composites

Wang,

Lou,

et al. 2024

J of Applied Polymer Sci

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External plasticization is one of the effective ways to toughen epoxy resins. In this study, an inorganic filler (EMD) was prepared by chemical modification of diatomite and was used to fill epoxy resin matrix. The effects of different amounts (5%, 10%, 15%, and 20%) of raw diatomite (RD) and modified‐diatomite (EMD) on the mechanical and thermal properties of epoxy resin composites were studied. The mechanical results showed that the impact strength, tensile strength, and bending strength of EMD/EP were higher than those of RD/EP. The impact strength of EMD‐15/EP reached 5.39 KJ/m2, which was 36.8% higher than that of RD‐15/EP. Thermogravimetric analysis showed that the thermal stability of EMD/EP was better than that of RD/EP. The results of DMA show that the glass transition temperature of EMD/EP was lower than that of RD/EP. Non‐isothermal differential scanning calorimetry study showed that the apparent activation energy of EMD‐15/EP was much lower than that of RD‐15/EP, which proved that EMD could promote the curing of epoxy resin. The Malek method was used to determine that both the RD‐15/EP and EMD‐15/EP curing systems were autocatalytic (Šesták–Berggren) models.

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Diatomite‐filled epoxy resin composites: Curing behavior, dielectric, and thermal properties

Cited by 16 publications

References 50 publications

Modification mechanism of modified diatomite with flexible amine‐based structure as a filler of epoxy resin and mechanical properties and curing kinetic of composites

Modification mechanism of modified diatomite with flexible amine‐based structure as a filler of epoxy resin and mechanical properties and curing kinetic of composites

Enhancing electromagnetic absorption in microwave of epoxy resin through incorporated surface modified aluminum oxide nanoparticles

The effects of the contents of modified‐diatomite on the properties of modified‐diatomite/epoxy resin composites

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