Die Bonding with Non-Clean Flux in Fine Pitch Copper Pillar Bump Study and Reliability Performance for 2.5D IC Package

Liao, Jerry; Liao, Ally; Peng, Sam; Lin, G. T.; Lu, Terrence; Chen, Stephen

doi:10.1109/ectc.2016.63

Cited by 7 publications

(1 citation statement)

References 2 publications

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“…In general, the in-line gating tools used in assembly are Xray, Scanning Acoustic Tomography (SAT), and open/short (O/S) tester before function test [1][2][3]. In this study, we used a multi-functionality O/S tester (DCT), which is ASE group developed to replace the traditional O/S tester (Smart1), as shown in Figure 1.…”

Section: Introductionmentioning

confidence: 99%

Universal Application of Load Board (L/B) and Socket with Direct Current Tester (DCT) for Various Packages

Lin

Hsiao

Tseng

et al. 2021

International Symposium for Testing and Failure Analysis

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We develop a new workflow with O/S tester (Direct Current Tester, DCT) to detect quickly the defect location of failure packages, which can be used in the semiconductor industry for E-FA (Electrical Failure Analysis) fault localization for short, leakage, and open defects. This paper introduces the capability and presents two case studies identifying the defect location of solder balls where DCT with defect mapping function is useful as a non-destructive analysis technique. In this paper, the new methodology and application of DCT on open and short defects in various packages with different sizes have been presented. The experimental results of the design testing program and an intender tooling were verified for the accuracy of the defect mapping function in determining the pin location to defect.

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Section: Introductionmentioning

confidence: 99%