2023
DOI: 10.1109/tim.2023.3322477
|View full text |Cite
|
Sign up to set email alerts
|

Die-Level Transient Thermal Imaging Based on Fourier Series Reconstruction for Power Industrial Electronics

Conrad Ferrer,
Oriol Aviñó,
Miquel Vellvehi
et al.

Abstract: A novel solution for off-chip electrothermal studies in power devices at die-level and short timescales is reported. The proposed method involves acquiring a sequence of thermal images on top of the die with an IR camera, while the device is biased under a periodic non-harmonic modulated current. Fourier coefficients are then extracted using lock-in strategies and the time evolution of the device thermal map is reconstructed using Fourier series. To evaluate and showcase its potential, the conventional approac… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
2
1

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
references
References 44 publications
0
0
0
Order By: Relevance