Dielectric Characterization of Stacked Packaging Substrates Using a Coaxial Transmission Line Technique

A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem

“…Both Dk and Df value have relatively large aberration under 1 GHz, and results produced by mm and mm also show little difference. A similar trend is observed for the measured extracted results in [ 2 ]. When using a differential phase length method [ 31 ], the size of the line affects the value of Dk and Df.…”

“…With the constant promotion of new infrastructures such as 5G and artificial intelligence, it is difficult to meet future development expectations just by enhancing system functionality and performance through process dimension reduction, single-chip area increase, and so on [ 1 , 2 ]. Microsystem technology, as an advanced integration technology that can overcome the limits of Moore’s Law, has emerged as one of the most important solutions for improving system performance, bandwidth, and power consumption [ 3 ].…”