Dielectric composite reinforced by in-situ growth of carbon nanotubes on boron nitride nanosheets with high thermal conductivity and mechanical strength

Li, Yun; Tian, Xiaojuan; Yang, Wang; Li, Qi; Hou, Liqiang; Zhu, Zhixin; Tang, Yushu; Wang, Minjian; Zhang, Bing; Pan, Ting; Li, Yongfeng

doi:10.1016/j.cej.2018.10.004

Cited by 83 publications

(31 citation statements)

References 55 publications

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“…Taking benefit from the synergistic effect of 3D hybrid fillers in heat dissipation, chemical vapor deposition (CVD) grown-carbon nanotubes (CNTs) on the surface of BNNSs has also been coupled with epoxy resin to produce a high TC TIM [68]. For this purpose, catalyst-loaded BNNSs are prepared by ultrasonication of a certain amount of BNNSs and nickel acetate, vacuum drying, and grinding to yield well-dispersed catalyst-BNNSs.…”

Section: Other Synthesis Methodsmentioning

confidence: 99%

“…Apart from polymers, hybrid fillers can potentially escalate the effectivity of the fillers' role throughout the matrix, more than individual h-BN sheets. The combination of different thermal conductive fillers like CNT [35,71], Graphene [72][73][74], Graphite [27,75], ZnO [76], Al 2 O 3 [77], and so on, with h-BN, leads to a synergetic effect in the TC performances among counterparts [68]. As an example, a promising hybrid nanocomposite of in-situ grown CNT on BNNSs embedded in epoxy resin exhibited a 615% and 380% TC performance improvement for the cross-plane direction compared with pure epoxy and BNNSs/epoxy composite, respectively.…”

Section: H-bn Within Hybrid Filler Configurationsmentioning

confidence: 99%

“…Adding a low volume of CNT (2 vol.%) builds bridges between BNNSs and improves their connectivity. Plus, BNNSs blockage of CNTs path maintains the electrical resistivity of the hybrid composite [68]. Another appealing hybrid composite is the vertically self-aligned BNNSs (50 wt.%)-FeCo (30 wt.%) as fillers in poly (diallyldimethylammonium chloride) (PDDA) as the matrix.…”

Section: H-bn Within Hybrid Filler Configurationsmentioning

confidence: 99%

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Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

et al. 2020

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Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.

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Section: Other Synthesis Methodsmentioning

confidence: 99%

Section: H-bn Within Hybrid Filler Configurationsmentioning

confidence: 99%

Section: H-bn Within Hybrid Filler Configurationsmentioning

confidence: 99%

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Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

et al. 2020

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“…The synthesized graphene foam (GF) has a highquality 3D interconnected graphene network that can effectively reduce the thermal resistance. [130] Li et al [131] prepared 3D filler network by growing CNT in situ on BNNS surface by a CVD method. When this filler network was embedded in the epoxy resin, the flexible carbon nanotubes and BNNS were tightly connected to form a 3D network.…”

Section: D Thermal Networkmentioning

confidence: 99%

Development and Challenges of Thermal Interface Materials: A Review

Yuan

Hussien

et al. 2021

Macro Materials & Eng

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With the development of electronic equipment components in the direction of integration, miniaturization, and intelligence, their increasingly high heat dissipation requirements pose a high challenge to the thermal conductivity (TC) of thermal interface materials (TIMs). Polymer-based composite materials with high TC have gradually been favored because of their good processing performance, low cost, and low density. It is important to summarize the relationship between the problems of low heat conduction and their solutions in relation to polymer-based composite materials. For this purpose, this review comprehensively discusses the basic mechanisms of heat transfer inside polymer-based TIMs, the current challenges, and future prospects for improving TC. Strategies involving surface modification and network construction can reduce interfacial thermal resistance and enhance heat conduction.

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“…18,19 In order to reduce the internal thermal effect of polymer composite, innovative strategies have been developed, 20,21 and the most straightforward approach is adding fillers with high thermal conductivity into polymer matrix. 22-24 Recently, multi-walled carbon nanotubes (MWCNTs), known for their magnificent thermal conductivity (1000–4000 W/(m K)) and ability to generate continuous 3D heat dissipation paths, have been validated to be an ideal filler for reinforcing the thermal conduction in a polymer composite. 25,26…”

Section: Introductionmentioning

confidence: 99%

High-temperature PMIA dielectric composites with enhanced thermal conductivity utilizing functionalized BaTiO₃ nanowires–carbon nanotubes fillers

Duan

Xin

et al. 2021

High Performance Polymers

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This study reports that a novel high-temperature poly (m-phenyleneisophthalamide) (PMIA) composite with enhanced dielectric constant and thermal conductivity was prepared by filling with BaTiO3 nanowires–carbon nanotubes (BTCNs) fillers. Due to effective functionalization of BaTiO3 nanowires (BTNWs) and multi-wall carbon nanotubes (MWCNTs), the fabricated BTCNs fillers were homogeneously dispersed in PMIA matrix. The consequence displays that the dielectric constant of PMIA composite with 15 wt % BTNWs fillers increases to 27.6 at 103 Hz, which is about nine times higher than that of pure PMIA. Moreover, owing to the high thermal conductivity of MWCNTs, the thermal conductivity of PMIA with 15 wt% BTNWs fillers increases to 1.01 W/(mK). The enhanced thermal conductivity is beneficial for BTCNs/PMIA composite to dissipate the generated heat by dielectric loss. Considering these merits, this research would provide new methods and ideas for preparation of high-temperature dielectric polymer composites and reducing the internal thermal effect.

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Dielectric composite reinforced by in-situ growth of carbon nanotubes on boron nitride nanosheets with high thermal conductivity and mechanical strength

Cited by 83 publications

References 55 publications

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

Development and Challenges of Thermal Interface Materials: A Review

High-temperature PMIA dielectric composites with enhanced thermal conductivity utilizing functionalized BaTiO₃ nanowires–carbon nanotubes fillers

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Dielectric composite reinforced by in-situ growth of carbon nanotubes on boron nitride nanosheets with high thermal conductivity and mechanical strength

Cited by 83 publications

References 55 publications

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

Development and Challenges of Thermal Interface Materials: A Review

High-temperature PMIA dielectric composites with enhanced thermal conductivity utilizing functionalized BaTiO3 nanowires–carbon nanotubes fillers

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Product

Resources

About

High-temperature PMIA dielectric composites with enhanced thermal conductivity utilizing functionalized BaTiO₃ nanowires–carbon nanotubes fillers