2016
DOI: 10.1002/adma.201505205
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Dielectric Engineering of a Boron Nitride/Hafnium Oxide Heterostructure for High‐Performance 2D Field Effect Transistors

Abstract: A unique design of a hexagonal boron nitride (h-BN)/HfO2 dielectric heterostructure stack is demonstrated, with few-layer h-BN to alleviate the surface optical phonon scattering, followed by high-κ HfO2 deposition to suppress Coulombic impurity scattering so that high-performance top-gated two-dimensional semiconductor transistors are achieved. Furthermore, this dielectric stack can also be extended to GaN-based transistors to enhance their performance.

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Cited by 77 publications
(49 citation statements)
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“…Thus, other 2D layered materials (2DLMs) with varying bandgaps including semimetals (such as WTe 2 ), topological insulators (such as Pb 1− x Sn x Te, Bi 2 Te 3 ), semiconductors (such as black phosphorous (BP), MoS 2 , WS 2 , WSe 2 ), insulators (such as boron nitride (BN)). Different from gapless graphene, these 2DLMs possess bandgaps in a wide range and can also be modulated with the changing thickness, which have triggered tremendous interest in many fields such as field effect transistors, photodetectors, flexible devices …”
Section: Introductionmentioning
confidence: 99%
“…Thus, other 2D layered materials (2DLMs) with varying bandgaps including semimetals (such as WTe 2 ), topological insulators (such as Pb 1− x Sn x Te, Bi 2 Te 3 ), semiconductors (such as black phosphorous (BP), MoS 2 , WS 2 , WSe 2 ), insulators (such as boron nitride (BN)). Different from gapless graphene, these 2DLMs possess bandgaps in a wide range and can also be modulated with the changing thickness, which have triggered tremendous interest in many fields such as field effect transistors, photodetectors, flexible devices …”
Section: Introductionmentioning
confidence: 99%
“…Field‐effect transistors (FETs) have been integrated into various electronic devices to achieve high‐speed and energy‐efficient switching . Typically, a high‐performance FET requires a semiconducting channel with high carrier mobility, reliable electrostatic control, and negligible contact resistance . As the FETs scaling into sub‐10 nm body thickness range, traditional bulk semiconductor materials, such as silicon and the III–V semiconductors, suffer from severe mobility degradation due to surface scattering and quantum confinement .…”
Section: Introductionmentioning
confidence: 99%
“…For ultrathin CVD h‐BN within 0.6 nm, the reduced insulator thickness makes electrons easier for direct tunneling . Moreover, the CVD h‐BN contains more defects than exfoliated h‐BN, which also plays an important role in tunneling transport (Figure S4, Supporting Information) …”
mentioning
confidence: 99%
“…After introducing a h‐BN layer, the peak mobility without contact resistance increased a little. The h‐BN act not only as a tunneling layer but also as an encapsulate layer to get rid of the influence of atmosphere and interfacial charge impurities scattering, thus can improve the channel conductance . With 1–2 layers h‐BN, the channel conductance without contact resistance is improved from 18.4 to 15.3 kΩ·μm.…”
mentioning
confidence: 99%