Dielectric properties of polyimide/SiO2 hollow spheres composite films with ultralow dielectric constant

Hong, Zhou; Wei, Dongyang; Ye, Fan; Chen, Hao; Yusen, Yang; Yu, Jiaojiao; Jin, Lei

doi:10.1016/j.mseb.2015.10.003

Cited by 64 publications

(32 citation statements)

References 26 publications

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“…Figure 1 shows the formation mechanism of the porous polyimide films. For polyimide materials, there are mainly two methods to reduce the dielectric constant: (1) reducing the material polarizability by introducing fluorine atom or lipid ring structure [8][9][10][11][12][13][14], and (2) reducing the number of polarizing molecules per unit volume by constructing a large skeleton structure to increase the free volume or by introducing air in the structure [15][16][17][18][19][20]. Since the intrinsic dielectric constant of air is extremely low, the dielectric constant of the material can be significantly reduced by injecting air into the polyimide system.…”

Section: Preparation Routes Of Porous Pi Filmsmentioning

confidence: 99%

Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

Zhang

et al. 2021

Crystals

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Due to the high value of its dielectric constant, polyimide does not meet the requirements of the development of integrated circuits and high-frequency printed circuits. The development of novel low dielectric constant polyimide materials for the preparation of flexible copper clad laminates is of theoretical and practical significance in the application of polyimide for 5G communications. In this work, different fluorinated graphene/polyamic acids (FG/PAA) were used as the precursor, and the porous polyimide film was successfully prepared by phase inversion. The dielectric constant of the porous polyimide film is relatively low, being less than 1.7. When the content of fluorinated graphene is 0.5 wt%, the overall dielectric performance of the porous film is the best, with a dielectric constant of 1.56 (10 kHz) and a characteristic breakdown field strength of 56.39 kV/mm. In addition, the mechanical properties of the film are relatively poor, with tensile strengths of 13.87 MPa (0.2 wt%), 13.61 MPa (0.5 wt%), and 6.25 MPa (1.0 wt%), respectively. Therefore, further improving the breakdown resistance and mechanical properties of the porous film is essential for the application of porous ultra-low dielectric polyimide materials.

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Section: Preparation Routes Of Porous Pi Filmsmentioning

confidence: 99%

Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

Zhang

et al. 2021

Crystals

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“…where the parameters involved in equation (5) are based on the increments from the sample structures, as seen in equations (6)- (9):…”

Section: Bicerano's Theorymentioning

confidence: 99%

“…4 However, fully aromatic polyimides limit the velocity of radiations from UV-VIS and microwave domains owing to high refractive index and high dielectric constant, which in turn are the result of the charge-transfer complex interactions. 5,6 A widely applied approach to diminish the values of these two physical parameters relies on using monomers with reduced polarity, such as fluorinated or aliphatic ones. [7][8][9] The latter led to the development of semi-aliphatic polyimides, which combine the thermal resistance of aromatic ones with improved transparency and electrical insulation properties that are typical for fully aliphatic imidic polymers.…”

Section: Introductionmentioning

confidence: 99%

Molecular design of some semi-alicyclic polyimides as a route to improve refraction and dielectric properties for liquid crystal display applications

Barzic¹,

Albu²,

Ioanid³

et al. 2017

High Performance Polymers

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The study establishes an adequate monomer combination for achieving the best balance of properties required in obtaining polyimide alignment layers for display devices. The molecular design of some aliphatic/aromatic polyimides was performed by using dianhydride monomers with distinct configurations in terms of rigidity, size, and symmetry. The polyimides based on semi-flexible and nonsymmetric dianhydride moieties present lower refractive index and dielectric constant (<3) than those obtained from symmetric and rigid dianhydride units. This determines faster traveling of visible and microwave radiations as required for liquid crystal alignment purposes. The interactions of samples with the N-(4-Methoxybenzylidene)-4-butylaniline, cyanobiphenyl, and 4-pentyl-4-cyanobiphenyl nematics were assessed. The analyzed polyimides have higher surface tensions than the ones of the liquid crystals, determining a parallel arrangement of the nematic molecules. As the dispersive interactions at the polymer surface are lower, the work of spreading is higher as a result of improved adhesion of liquid crystal with the polyimide alignment layer. The sample containing rigid, symmetric, noncoplanar dianhydride units (PI.4) and the one based on semi-flexible, nonsymmetric dianhydride moieties are the most transparent for visible and microwave radiations, allowing low cohesion interaction at interface with nematics. These aspects recommend the two studied polyimides as candidates for alignment layers.

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“…As reported, the inorganic materials include silicon nanotubes, 17,18 phyllosilicates, 19 fluorographene (FG), 13 hollow glass microspheres (HGM), 20 and so forth. Zhang et al 21 employed silica hollow spheres (SHS) modified by silane coupling agent as nanofillers to fabricate PI/SHS composite films, the dielectric constant of which decreased from 3.41 to 2.09 when SHS loading was 10 wt%. Yudin et al 17 fabricated silicate nanotubes (SNTs)/PI composite films with the low dielectric constant (about 2) and better mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

Polyimide hollow glass microspheres composite films with low dielectric constant and excellent thermal performance

Cao

Wen

Song

et al. 2021

J of Applied Polymer Sci

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Nowadays, polyimide (PI) with low dielectric constant is expected to be widely applied in microelectronics. For this reason, hollow glass microspheres (HGM) modified by silane coupling agent KH-550 (K-HGM), a series of HGM/PI and K-HGM/PI composite films with excellent thermal performance, hydrophobic and low dielectric constant were fabricated by in situ polymerization. The effect of HGM/K-HGM content on the properties of composite films was studied. The superior heat resistance of HGM can improve the thermal performance of composite films. Due to silane coupling agent KH-550, K-HGM exhibits a good interfacial compatibility with PI matrix and forms an interfacial adhesion region. With the HGM loading of 6%, comparing with pure PI films, the glass transition temperatures (T g) of composite films were dramatically increased by 32.3 C. Especially, the low dielectric constant of 2.21 and dielectric loss of 0.0059 at 1 MHz were obtained for the PI/K-HGM composite film with addition of 8 wt%. Thus, PI/K-HGM composite films show more excellent performance. The current work provides a promising solution for fabrication of PI with low dielectric constant and superior thermal performance that may be applied in microelectronics industry.

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Dielectric properties of polyimide/SiO2 hollow spheres composite films with ultralow dielectric constant

Cited by 64 publications

References 26 publications

Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

Preparation of Polyimide Films with Ultra-Low Dielectric Constant by Phase Inversion

Molecular design of some semi-alicyclic polyimides as a route to improve refraction and dielectric properties for liquid crystal display applications

Polyimide hollow glass microspheres composite films with low dielectric constant and excellent thermal performance

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