Dielectric resolution enhancement coating technology (DiRECT) - a sub-90 nm space and hole patterning technology using 248-nm lithography and plasma-enhanced polymerization

Abstract

A plasma polymerization coating process named Dielectric Resolution Enhancement Coating Technology (Di-RECT) is proposed to shrink critical dimensions (CDs) of space and hole patterns. Fluorocarbon plasmas are used as the precursors to coat a polymer layer on the patterned photo-resist. By adding only one processing step, we are able to shrink poly space and contact hole to sub-90 nm-level using 248-nm lithography. The results of our extensive tests have demonstrated the production-worthiness of this technique for its consistent lot-to-lot repeatability, tight within-wafer CD uniformity, and low defect level.