Dielectric strength and thermal performance of PCB-embedded power electronics

Randoll, Richard; Wondrak, W.; Schletz, Andreas

doi:10.1016/j.microrel.2014.07.139

Cited by 12 publications

(4 citation statements)

References 6 publications

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“…To increase the power capability, the thermal resistance should be as low as possible, meaning that insulating layers of typically ceramics or FR4 are made thin. Even a low voltage applied to a thin layer may produce higher electric field strengths compared with power modules operated at several kilovolts [4], [5]. In conclusion, maintaining a safe operating margin of the electric field strength and keeping a low thermal resistance is often a compromise, and thus understanding of both problems is important to achieve a good performing power module.…”

Section: B Thermo-mechanical Induced Stressmentioning

confidence: 99%

Overview of Digital Design and Finite-Element Analysis in Modern Power Electronic Packaging

Jørgensen

Munk‐Nielsen

Uhrenfeldt

2020

IEEE Trans. Power Electron.

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Wide band gap semiconductors require packaging with reduced parasitic inductance and capacitance. To achieve this, new packaging solutions are proposed which increase integration. This causes difficulty in measurement of voltages, currents and device temperature, and therefore designers must rely more heavily on simulations to gain insight in the operation of the developed prototypes. Additionally, the use of digital design may reduce the number of physical prototype iterations and thereby reduces development time. Gaining fidelity of 3D multi-physics simulations, reduced order modelling and system simulation aids in the design of working prototypes and pushes performance of new power modules based on wide band gap semiconductor devices. This paper provides an overview and discusses the recent advances in the use of finite element analysis and simulation tools within the topic of power module packaging. The main aspects covered are extraction of electrical parasitics, simulation of transient thermal response and issues related to evaluation of electric fields. An example of a simulation software roadmap is presented which enables accurate electrothermal simulation of new packaging structures that combine conventional power module technology with integrated printed circuit boards. The future challenges for utilizing the potential of digital design are discussed.

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Section: B Thermo-mechanical Induced Stressmentioning

confidence: 99%

Overview of Digital Design and Finite-Element Analysis in Modern Power Electronic Packaging

Jørgensen

Munk‐Nielsen

Uhrenfeldt

2020

IEEE Trans. Power Electron.

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“…FR4 materials traditionally used for PCB applications are not designed to sustain harsh power cycles (ΔT > 120°C), resulting in large thermal stresses and leading to mechanical failure [4], [5]. For integrated high-voltage power converters, such damages are likely to hamper the cooling capabilities (degraded thermal contact, burnout) and trigger electrical damage events (partial discharges, breakdowns) ultimately leading to device failure.…”

Section: Introductionmentioning

confidence: 99%

New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications

Arati,

Bley,

Pichon

et al. 2023

IEEE Access

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Printed Circuit Board (PCB)-embedded power electronics packages are anticipated as the next major packaging trend to support efficient and reliable electrical energy conversions. With many core aspects of the package being modified, the dielectric is now required to ensure new functions while still assuming its original electrical insulation function. With the expected increase of operational voltages that come with wide bandgap semiconductor components, high-reliability dielectric packaging materials are required. Given the recent breakthrough in polymeric science, self-healing materials based on Covalent Adaptable Networks (CANs) can be applied to highly stressed systems such as integrated power modules, with the aim to improve the reliability of the package. This work proposes a critical evaluation of the compatibility of a CAN to the requirements of the power electronics field and evaluates the recovery efficiency through mechanical and electrical indicators.

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“…PCB embedded power electronics offers improvements compared to power electronics bonded and soldered on Al 2 O 3 as dielectric material [1,2]. These improvements are smaller size, lightweight construction, cost efficiency of the applied materials and low parasitic inductances [3,7].…”

Section: Introductionmentioning

confidence: 99%