Dielectric thickness and ground width effect on multilayer coplanar components and circuits for ceramic multichip modules

Abstract

This article investigates the effect of dielectric thickness and ground width on the performance of multilayer conductor backed coplanar waveguide lumped elements and circuits fabricated on advanced multilayer photoimageable thick‐film ceramic multichip module (MCM) technology. From the S‐parameters, the effective dielectric constant is extracted to investigate the effect of dielectric thickness and ground‐width on transmission line dispersion. The equivalent circuit parameters for multilayer ceramic‐based capacitors and inductors are investigated for various dielectric thicknesses and ground‐plane widths. Finally, the practical effect of dielectric thickness and ground width are investigated for a highly compact and high performance lumped element low pass filter at 3 GHz, developed for cost‐effective MCM applications. © 2012 Wiley Periodicals, Inc. Microwave Opt Technol Lett 54:1127–1132, 2012

Wi-Fi Energy Harvester for Low Power Rfid Application

“…Within a lumped element lowpass filter, thicker dielectric height gave better performance compared to a thinner one. This can be explained as dominating parasitic influences impeding voltage gain as a result from a study investigating the effects of dielectric thickness on lumped element LPF using RO5880 material which revealed that thicker dielectric height with lower effective dielectric constant produced better output response [21].…”

Experimental study of the effect of ground width for millimetre-wave multilayer coplanar waveguides in ceramic multichip module technology

“…The photoimageable thick film has been used previously to successfully develop a wide range of miniaturised passive components with challenging performance up to 60 GHz [12 -18]. Using this advanced technology the thin-film microstrip and initial results for the CPW have been reported [13,15] and have successfully demonstrated a compact and complete mm-wave MCM receiver at 65 GHz integrating MMICs with other embedded passive components [8,12]. Furthermore, the technology is compatible with many fabrication processes including LTCC and thin film, and is being considered as a viable approach to realise compact and cost-effective ceramicbased microwave and mm-wave multi-chip-modules (MCMs) and SIP architectures [8,9,18,19].…”