13th International Symposium on the Physical and Failure Analysis of Integrated Circuits 2006
DOI: 10.1109/ipfa.2006.251006
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Diffractive lenses for high resolution laser based failure analysis

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Cited by 11 publications
(5 citation statements)
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“…Previous works have made approaches in this direction, e.g. by shaping round refractive SILs with computer numerical controlled (CNC) milling [3] and by FIB etching [4] or by creating flat diffractive SILs with FIB for monochromatic (single wavelength) applications [5].…”
Section: Motivation and Optical Aspects Of This Workmentioning
confidence: 99%
“…Previous works have made approaches in this direction, e.g. by shaping round refractive SILs with computer numerical controlled (CNC) milling [3] and by FIB etching [4] or by creating flat diffractive SILs with FIB for monochromatic (single wavelength) applications [5].…”
Section: Motivation and Optical Aspects Of This Workmentioning
confidence: 99%
“…This FOSSIL approach can be implemented at the device fabrication stage in order to alleviate SIL positioning errors. Furthermore, Zachariasse et al have reported a novel solid immersion blazed-phase diffractive lens for high resolution laser based failure analysis of silicon ICs [74]. The technique uses a general design algorithm using computer generated holography to create a numerical program that calculates the structure required for reconstruction of a spherical wavefront through a silicon substrate into any user-defined pattern.…”
Section: Solid Immersion Lens Substrates For Enhanced Ic Failure Analmentioning
confidence: 99%
“…Solid [3] and liquid [4] immersion lens technologies have been used to extend the diffraction limit by increasing NA. The two main types of solid immersion lens (SIL) technologies that are applicable to backside FA are Refractive SIL (RSIL) [3] and Diffractive SIL [5].…”
Section: Introductionmentioning
confidence: 99%