Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

Choi, Hyeokgi; Kim, Chang-Lae; Sohn, Yoonchul

doi:10.3390/ma15238419

Cited by 6 publications

(2 citation statements)

References 36 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It is established that the reaction between Sn-58Bi solder and ENIG results in the formation of Ni 3 Sn 4 IMCs at the interface [17][18][19][20][21][22][23][24]. Initially, when the number of IPL irradiation sessions is limited, the thickness of the formed IMC remains minimal.…”

Section: Microstructural Evolution During Ipl Solderingmentioning

confidence: 99%

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

Go,

Noh,

Jung

et al. 2024

Crystals

Self Cite

View full text Add to dashboard Cite

In this study, intense pulsed light (IPL) soldering was employed on Sn-58Bi solder pastes with two distinct particle sizes (T3: 25–45 μm and T9: 1–8 μm) to investigate the correlation between the solder microstructure and mechanical properties as a function of IPL irradiation times. During IPL soldering, a gradual transition from an immature to a refined to a coarsened microstructure was observed in the solder, impacting its mechanical strength (hardness), which initially exhibited a slight increase followed by a subsequent decrease. It is noted that hardness measurements taken during the immature stage may exhibit slight deviations from the Hall–Petch relationship. Experimental findings revealed that as the number of IPL irradiation sessions increased, solder particles progressively coalesced, forming a unified mass after 30 sessions. Subsequently, after 30–40 IPL sessions, notable voids were observed within the T3 solder, while fewer voids were detected at the T9-ENIG interface. Following IPL soldering, a thin layered structure of Ni3Sn4 intermetallic compound (IMC) was observed at the Sn-58Bi/ENIG interface. In contrast, reflow soldering resulted in the abundant formation of rod-shaped Ni3Sn4 IMCs not only at the reaction interface but also within the solder bulk, accompanied by the notable presence of a P-rich layer beneath the IMC.

show abstract

Section: Microstructural Evolution During Ipl Solderingmentioning

confidence: 99%

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

Go,

Noh,

Jung

et al. 2024

Crystals

Self Cite

View full text Add to dashboard Cite

show abstract

“…Due to the low melting point of solder alloys, soldering can be done at relatively low operation temperatures, minimizing thermal damage. In the soldering process, molten solder reacts with the metallization, resulting in the formation of intermetallic compounds (IMCs) at the joint interfaces [8][9][10]. IMC formation is an indicator of successful joints, like the Cu 6 Sn 5 and Cu 3 Sn phase in Sn-based solder/Cu joints [11,12].…”

Section: Introductionmentioning

confidence: 99%

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Li,

Yen,

Chen

2024

Materials

View full text Add to dashboard Cite

Sn-3Ag-0.5Cu (SAC305)- and Sn-9Zn-based alloys (Sn-Zn-X, X = Al, In) are lead-free solders used in the fabrication of solder joints with Cu metallization. Electroplating is a facile technology used to fabricate Cu metallization. However, the addition of functional additive molecules in the plating solution may result in impurity residues in the Cu electroplated layer, causing damage to the solder joints. This study investigates the impurity effect on solder joints constructed by joining various solder alloys to the Cu electroplated layers. Functional additives are formulated to fabricate high-impurity and low-impurity Cu electroplated samples. The as-joined solder joint samples are thermally aged at 120 °C and 170 °C to explore the interfacial reactions between solder alloys and Cu. The results show that the impurity effect on the interfacial reactions between SAC305 and Cu is significant. Voids are massively formed at the SAC305/Cu interface incorporated with a high impurity content, and the Cu6Sn5 intermetallic compound (IMC) grows at a faster rate. In contrast, the growth of the Cu5Zn8 IMC formed in the SnZn-based solder joints is not significantly influenced by the impurity content in the Cu electroplated layers. Voids are not observed in the SnZn-based solder joints regardless of the impurity content, indicative of an insignificant impurity effect. The discrepancy of the impurity effect is rationalized by the differences in the IMC formation and associated atomic interdiffusion in the SAC305- and SnZn-based solder joints.

show abstract

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

Dele‐Afolabi

Ansari

Hanim

et al. 2023

Journal of Materials Research and Technology

View full text Add to dashboard Cite

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

Cited by 6 publications

References 36 publications

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

Contact Info

Product

Resources

About