Diffusion brazing of Ti–6Al–4V and AISI 304: an EBSD study and mechanical properties

Norouzi, Ehsan; Shamanian, M.; Atapour, Masoud; Khosravi, Babak

doi:10.1007/s10853-017-1376-z

Cited by 30 publications

(6 citation statements)

References 22 publications

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“…The gray micro-region A containing 34.56 at.% Ti and 65.44 at.% Cu is inferred as TiCu2. The detection of TiCu2 in the bonding area was also reported by Ehsan et al [14] in Ti6Al4V/AISI 304 steel bonding with Cu interlayer and by Elrefaey and Tillmann [15] in Ti/low carbon steel bonding with Cu-12Mn-2Ni (wt %) interlayer. For the light-gray micro-region B, the atomic ratio of Ti/Cu is about 1:4, corresponding to TiCu4.…”

Section: Microstructure Of Joint With Ti/cu/ti Multi-foilssupporting

confidence: 75%

Bonding of graphite to Cu with metal multi-foils

Cai

et al. 2023

Archiv.Civ.Mech.Eng

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Graphite/Cu bonding is essential for the fabrication of graphite-based plasma-facing parts and graphite-type commutators. Transient liquid phase bonding of graphite/Cu has been conducted separately with Ti/Cu/Ti and Ti/Cu/Ni/Ti multi-foils. The interfacial microstructure and mechanical properties of the bonded joints have been characterized. For the joint with Ti/Cu/Ti multi-foils, complete melting of the Ti/Cu/Ti multi-foils and interdiffusion between the molten zone and the Cu substrate occur during the bonding process, leading to formation of Ti-Cu intermetallics in the bonding area. The liquid phase flowing towards sidewall of the Cu substrate gives rise to a thickness of the bonding area far less than those of the as-received multi-foils. For the joint with Ti/Cu/Ni/Ti multi-foils, the bonding area can be divided into three parts (areas I, II and III). The bonding areas I and III are comprised of Ti-Cu intermetallics and Ti(CuxNi1-x)2, while the bonding area II consists of a Ni layer and two thin TiNi3 reaction layers. The thickness of the whole bonding area is similar to those of the as-received multi-foils, indicating that addition of Ni foil can prevent the loss of liquid phase zone by inhibiting the excessive liquid phase formation. The addition of a Ni foil in bonding of the graphite/Cu may alleviate the joint residual stress by its intermediate coefficient of thermal expansion (CTE) to accommodate any thermal mismatch in the joint and by its superior ductility and plasticity, thus resulting in shear strength promotion of the joint with the Ti/Cu/Ni/Ti multi-foils by approximately 35% when compared to the Ti/Cu/Ti multi-foils.

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Section: Microstructure Of Joint With Ti/cu/ti Multi-foilssupporting

confidence: 75%

Bonding of graphite to Cu with metal multi-foils

Cai

et al. 2023

Archiv.Civ.Mech.Eng

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“…Ti 2 Cu with α-Ti was produced by eutectoid reaction β-Ti ↔ α-Ti + Ti 2 Cu. e content of the TiFe phase is less than that of the CuTi phase, which is due to the fact that the diffusion rate of Ti in Cu is higher than that of Fe in Cu, thus declining the brittleness of joints [72]. Norouzi et al [73] also studied the effect of bonding time on the property of the transient liquid-phase bonded joints with copper as the interlayer.…”

Section: Cu Interlayermentioning

confidence: 99%

A Review on Diffusion Bonding between Titanium Alloys and Stainless Steels

Song

Fang

et al. 2018

Advances in Materials Science and Engineering

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High-quality joints between titanium alloys and stainless steels have found applications for nuclear, petrochemical, cryogenic, and aerospace industries due to their relatively low cost, lightweight, high corrosion resistance, and appreciable mechanical properties.is article reviews diffusion bonding between titanium alloys and stainless steels with or without interlayers. For diffusion bonding of a titanium alloy and a stainless steel without an interlayer, the optimized temperature is in the range of 800-950°C for a period of 60-120 min. Sound joint can be obtained, but brittle FeTi and Fe-Cr-Ti phases are formed at the interface. e development process of a joint mainly includes three steps: matching surface closure, growth of brittle intermetallic compounds, and formation of the Kirkendall voids. Growth kinetics of interfacial phases needs further clarification in terms of growth velocity of the reacting layer, moving speed of the phase interface, and the order for a new phase appears. e influence of Cu, Ni (or nickel alloy), and Ag interlayers on the microstructures and mechanical properties of the joints is systematically summarized. e content of FeTi and Fe-Cr-Ti phases at the interface can be declined significantly by the addition of an interlayer. Application of multi-interlayer well prevents the formation of intermetallic phases by forming solid solution at the interface, and parameters can be predicted by using a parabolic diffusion law. e selection of multi-interlayer was done based on two principles: no formation of brittle intermetallic phases and transitional physical properties between titanium alloy and stainless steel.

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“…Interestingly, the direct diffusion-bonded joints exhibited better shear properties, whereas the shear performance of the joints produced with the Cu interlayer (Figure 9 MPa) produced by direct bonding [4,40] and with Cu and Ni interlayers. [2,12,14,25,30,31,41] However, these values are higher than those reported by Elrefaey and Tillmann [27] for CP-Ti/Cu/low carbon steel (50-105 MPa) and by Ö zdemir and Bilgin [42] for Ti64/Cu/SS (20 to 120 MPa). Nevertheless, the shear strength results of the present study are comparable to those of the Ti64/IF steel joint reported by Kaya et al [17] Most of these studies claimed that Ti-Fe intermetallics at the interface are more detrimental than other intermetallics.…”

Section: Interface Microstructure Of the Joint Produced With Cu+ni Inmentioning

confidence: 61%

“…[27] Both the spot and line EDS analyses showed the presence of a significant amount of Ti on the Fe side (i.e., layer F) and resulted in formation of the TiFe intermetallic phase due to the reduced barrier effect of the Cu interlayer and increased interdiffusion between Ti and Cu. [2,30] It is important to note that the bonding temperature of 1123 K is still below the eutectic transformation temperature of Ti-Cu (~1148 K). [29] Hence, no formation of any transient liquid phase and Cu 2 Ti compound formation can be expected under these bonding conditions.…”

Section: A Microstructures At Interfaces Of the Diffusion-bonded Jointsmentioning

confidence: 99%

Microstructure and Mechanical Properties of Ti-6Al-4V Alloy/Interstitial Free Steel Joint Diffusion Bonded with Application of Copper and Nickel Interlayers

Raj

Prasad

Narasimhan

2020

Metall Mater Trans A

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The application of interlayers in solid-state diffusion bonding is considered for facilitating improved joint strength as well as optimizing the bonding parameters. In case of dissimilar metals, the interlayers are preferred to promote diffusivity by reducing the metallurgical incompatibility. In the present work, the effect of formation of intermetallics at interfaces of the dissimilar joints between Ti-6Al-4V (Ti64) alloy and interstitial free (IF) steel, produced by direct diffusion bonding as well as by using the interlayers of copper and nickel, was evaluated. The diffusion bonding experiments were performed in a temperature range of 1023 K to 1223 K, under a constant pressure of 10 MPa for 10 minutes, in high vacuum conditions. It was observed that diffusion of interlayer(s) into the base metals increased with bonding temperature, which led to the increase in intermetallic layers at the joint interface. At 1223 K, the influence of interlayer on microstructure of interfaces was reduced by complete diffusion of interlayers and subsequently led to the interdiffusion of base metals. The maximum shear strength of~186 MPa was recorded for the bonding performed using a nickel interlayer at 1023 K. Detailed microstructure analysis, nanoindentation measurements and shear tests suggest that the presence of a thin layer of hard TiFe intermetallic at the interface has no adverse effect, but a soft remnant interlayer can deteriorate the shear properties of the diffusion-bonded joints.

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Diffusion brazing of Ti–6Al–4V and AISI 304: an EBSD study and mechanical properties

Cited by 30 publications

References 22 publications

Bonding of graphite to Cu with metal multi-foils

Bonding of graphite to Cu with metal multi-foils

A Review on Diffusion Bonding between Titanium Alloys and Stainless Steels

Microstructure and Mechanical Properties of Ti-6Al-4V Alloy/Interstitial Free Steel Joint Diffusion Bonded with Application of Copper and Nickel Interlayers

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