Dihedral angles in Cu–1 wt.% Pb: Grain boundary energy and grain boundary triple line effects

Empl, Doris; Felberbaum, Laurent; Laporte, Vincent; Chatain, Dominique; Mortensen, Alicja

doi:10.1016/j.actamat.2009.02.009

Cited by 18 publications

(5 citation statements)

References 55 publications

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“…The correct h value appears only in the section containing the common axis of both spherical solid/liquid interfaces. It can be measured either using transmission electron microscopy [12] or by careful three-dimensional analysis of the droplet shape [21,22]. If such methods are not practical due to the large numbers of boundaries to be characterised, then the wetting state is instead evaluated by analysing the appearance of the wetting layers of the second phase and categorising them as either completely, incompletely or not Fig.…”

Section: Introduction Grain Boundary Wetting Transitionmentioning

confidence: 99%

Influence of the grain boundary character on the temperature of transition to complete wetting in the Cu–In system

et al. 2015

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The incomplete to complete grain boundary (GB) wetting transition is controlled by GB energy and, therefore, by GB character. To find the GB character dependence of the wetting transition, experiments were carried out on polycrystalline Cu-In alloys, which are known to exhibit wetting behaviour between 715 and 986°C. Electron backscatter diffraction was applied to determine the two-dimensional GB character, using the coincidence site lattice (CSL) model and applying the Brandon criterion. Special wetting behaviour was found in those GBs characterised as low-angle, R3 and R11. The low-angle and R3 GBs were not wetted until the sample melted, while the temperature for the transition to complete wetting of R11 GBs was over 100°C higher than that for complete wetting of all other types of GB, including other CSL GB as well as random GB. It might be that a different Brandon type criterion is needed in the case of GB wetting to show the ''special'' wetting behaviour of the CSL GBs.

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Section: Introduction Grain Boundary Wetting Transitionmentioning

confidence: 99%

Influence of the grain boundary character on the temperature of transition to complete wetting in the Cu–In system

et al. 2015

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“…Dihedral angles given by different sources do not coincide well with each other. For example, the lowest values of ϕ measured at 800 and 900 °C have been reported by Nakamoto et al (43° and 38°, respectively), while Empl et al found 75° and 70° at the same temperatures. Values of ψ′ were determined by Hara et al to be equal to 129° at 800–900 °C, while Nakamoto et al give 138° at 800 °C and 144° at 900 °C.…”

Section: Resultsmentioning

confidence: 84%

“…Dihedral angles given by different sources do not coincide well with each other. For example, the lowest values of ϕ measured at 800 and 900 °C have been reported by Nakamoto et al 26 (43°and 38°, respectively), while Empl et al 28 It was pointed out by ref 30 that two layers are generally sufficient to estimate the influence of surface composition on the interfacial energy, even at temperatures close to the melting point of the solid phase.…”

Section: Surface Tension Of Lead Melts Saturated Withmentioning

confidence: 94%

Adsorption Effect on Wetting in a Copper/Lead System

et al. 2016

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Complex analysis of interfacial thermodynamics was performed for a lead–copper binary system. Contact angle on polycrystalline copper and surface tension was measured for saturated Pb–Cu alloys at 390–1000 and 390–800 °C temperature ranges correspondingly. Liquid–gas and interfacial solid–liquid energies were calculated for Pb–Cu binary system by statistical thermodynamics on the basis of regular solution approximation at 390–950 °C. Calculated values coincide well with measured ones and with literature data, except for the temperature region lower than 700 °C, where the reported values of interfacial energy seem to be overestimated. Analysis of literature data leads us to the conclusion that an adsorbed monolayer film of lead exists in equilibrium with Pb–Cu drop on copper/gas interface between 250 and 900 °C. The decrease of the solid/gas surface energy due to Pb adsorption was calculated on the basis of the Young equation and fitted with the Szyszkowski equation. An adsorption energy of 276 kJ/mol and a vibration period of 2.79 × 10–14 s–1 were found.

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“…It has been reported in the literature that the interfacial energy between liquid Pb and solid Cu (c Pb(l)/Cu(s) ) is temperature dependent. [18] According to Empl et al, the liquid Pb does not wet Cu grains beyond 673 K (400°C). Although, liquid Pb is present in the sample, it leads to a decrease in densification due to dewetting of Cu grains.…”

Section: Discussionmentioning

confidence: 98%