2014
DOI: 10.1364/prj.2.0000a8
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Direct bandgap germanium-on-silicon inferred from 57% 〈100〉 uniaxial tensile strain [Invited]

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Cited by 151 publications
(141 citation statements)
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“…Great efforts have been made to modify these materials, e.g. by applying tensile strain and/or by forming alloys, [16][17][18][19] in order to obtain a direct band gap. Here, Ge plays an essential role, since the energy difference between the conduction band -valley at the center of the Brillouin zone and the L-valleys, the energetically lowest conduction bands, is only 140 meV.…”
Section: Introductionmentioning
confidence: 99%
“…Great efforts have been made to modify these materials, e.g. by applying tensile strain and/or by forming alloys, [16][17][18][19] in order to obtain a direct band gap. Here, Ge plays an essential role, since the energy difference between the conduction band -valley at the center of the Brillouin zone and the L-valleys, the energetically lowest conduction bands, is only 140 meV.…”
Section: Introductionmentioning
confidence: 99%
“…While this strain can be a useful starting point, it is not enough to reduce threshold current density to a practical level. Other methods include depositing nitride stressor layers [16][17][18][19], suspending silicon dioxide and then transferring the strain into Ge micro disks [20,21] and suspending Germanium directly (the focus of this paper) [22][23][24][25][26][27][28][29][30].Suspended structures amplify the small amounts of tensile biaxial strain introduced during the epitaxial growth of Ge on Si. Certain regions of the Ge are suspended in which the membrane constricts resulting in an enhancement of the tensile strain, and the regions which are still tethered to the rest of the wafer (referred to as pads) relax resulting in a compressive strain.…”
Section: Introductionmentioning
confidence: 99%
“…Ge, an indirect bandgap semiconductor, highly compatible with Si technology, has been predicted to exhibit a direct gap under high tensile strain (Zhang & Crespi, 2009), and various fabrication approaches have been proposed (Sun et al, 2009;Sü ess et al, 2013;Sukhdeo et al, 2014).…”
Section: Introductionmentioning
confidence: 99%