Direct Electroless Copper Deposition on A Photolithographic Pattern of Palladium-Nanoparticle/Acrylic-Polymer Hybrid

Abstract

A palladium-nanoparticle/acrylic-polymer hybrid negative pattern was formed on a flexible film by photolithography and then converted to a copper pattern by electroless plating. The negative pattern of the hybrid was formed by UV-irradiation of the resist film, which contained acrylate monomer, palladium salt, and a photo-radical initiator. The photochemically generated radicals induced the radical polymerization of the acrylate and also reduced the palladium ion to form palladium nanoparticles. A copper film was deposited on the surface of the hybrid pattern by electroless plating, where the palladium nanoparticles work as a catalyst.

Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

“…Ag has successfully been used as a metal catalyst for electroless copper plating (ECP) [6]. Pd is a choice catalytic material for electroless plating due to its high activity [11]; however, palladium price per gram exceeds silver price by almost 70 times, limiting its use for large-scale production.…”

Surface modification of PEN and PET substrates by plasma treatment and layer-by-layer assembly of polyelectrolyte multilayer thin films and their application in electroless deposition

“…14 Direct electroless metal deposition on a smooth polymer surface without affecting the bulk properties is expected to be applicable to simple and economical manufacturing of metallic patterns for exible electronics. For the electroless deposition, the polymer substrate surface should contain palladium nanoparticle catalysts and be compatible with the metal lm, 27,28 although common polymer surfaces are hydrophobic and not compatible with metals. Therefore, an interlayer that is compatible both with the polymer and with the metal and contains a catalyst is desired to be formed on the polymer surface.…”

In‐situ formation of metal nanoparticle/acrylic polymer hybrid and its application to miniemulsion polymerization

“…Electroless plating is a simple and cost‐effective method not only for metallization of polymer substrates but also for fabrication of metallic patterns on polymer substrates used in printed circuits boards. Recently, to fabricate a micropattern, an approach containing direct metallization of photolithographic and printed patterns has attracted much attention . We reported the fabrication of micropatterns by direct electroless copper deposition on a pattern of palladium nanoparticle/silica nanoparticle/acrylic polymer hybrid formed by photolithography .…”

“…Recently, to fabricate a micropattern, an approach containing direct metallization of photolithographic and printed patterns has attracted much attention . We reported the fabrication of micropatterns by direct electroless copper deposition on a pattern of palladium nanoparticle/silica nanoparticle/acrylic polymer hybrid formed by photolithography . Palladium is a typical precious metal and its nanoparticles are useful as a catalyst, while nanoparticles of a common metal such as silver for a cost effective catalyst are desired.…”