Current estimates by the World Health Organization (WHO) suggest that the number of deaths caused by multidrug-resistant bacteria worldwide could rise to ten million per year by 2050, if the current trend continues. [2] One way to fight both critical biofilm formation as well as the spreading of infectious diseases is to reduce the survivability of bacteria on technically and frequently touched contact surfaces, by using actively antimicrobial materials like copper (Cu) and silver (Ag) that are not based on pharmaceutical antibiotics. Here, Cu shows great potential for a wider application, [3,4] looking back to a multi-millennial history of repeated rediscovery of its aseptic properties, [5] while it is also involved as a trace element in central processes of human metabolism. [6] In contrast, Ag exhibits toxicity at low quantities, [7] by which dosing has to be precisely adjusted in case of antimicrobial application to avoid a negative immune response. [8] Due to the toxic effect of released Cu ions, bacteria [9,10] as well as viruses [11] are rapidly killed in both dry and moist environments, when adhering to Cu surfaces. The antimicrobial properties of Cu are closely linked to both the amount of ions released and absorbed by the attacked microorganism, whereby specific effects have to be considered when using Cu as an antimicrobial agent: 1) It Copper (Cu) exhibits great potential for application in the design of antimicrobial contact surfaces aiming to reduce pathogenic contamination in public areas as well as clinically critical environments. However, current application perspectives rely purely on the toxic effect of emitted Cu ions, without considering influences on the interaction of pathogenic microorganisms with the surface to enhance antimicrobial efficiency. In this study, it is investigated on how antibacterial properties of Cu surfaces against Escherichia coli can be increased by tailored functionalization of the substrate surface by means of ultrashort pulsed direct laser interference patterning (USP-DLIP). Surface patterns in the scale range of single bacteria cells are fabricated to purposefully increase bacteria/surface contact area, while parallel modification of the surface chemistry allows to involve the aspect of surface wettability into bacterial attachment and the resulting antibacterial effectivity. The results exhibit a delicate interplay between bacterial adhesion and the expression of antibacterial properties, where a reduction of bacterial cell viability of up to 15-fold can be achieved for E. coli on USP-DLIP surfaces in comparison to smooth Cu surfaces. Thereby, it can be shown how the antimicrobial properties of copper surfaces can be additionally enhanced by targeted surface functionalization.