Abstract:We demonstrate a simple way to fabricate amorphous micro-rings in crystalline silicon using direct laser writing. The method is based on the fact that the phase of a thin surface layer can be changed into the amorphous phase by irradiation with a few ultrashort laser pulses (800 nm wavelength and 100 fs duration). Surface-depressed amorphous rings with a central crystalline disk can be fabricated without the need for beam shaping, featuring attractive optical, topographical, and electrical properties. The underlying formation mechanism and phase change path way have been investigated by means of fs-resolved microscopy, identifying fluence-dependent melting and solidification dynamics of the material as the responsible mechanism. We demonstrate that the lateral dimensions of the rings can be scaled and that the rings can be stitched together, forming extended arrays of structures not limited to annular shapes. This technique and the resulting structures may find applications in a variety of fields in optics, nanoelectronics, and mechatronics.
Text:Silicon is more than just a key material for the electronics industry; it can be considered one of the pillars the industry is built on. Si owes this position essentially to its abundance on earth, its semiconducting properties and the existence of two structurally different solid phases (crystalline and amorphous), having very different physical properties. In this context it is worth noting that the amorphous phase can be formed by a variety of methods, including chemical and physical vapour deposition techniques, ion implantation and melting followed by rapid quenching. While some of the properties of the amorphous phase are known to depend on the preparation method 1 it has to be kept in mind that it is still a tetrahedrally coordinated semiconductor with a coordination number close to four 2 , just as the crystalline phase.Laser processing of Si started immediately after sufficiently intense lasers were available 3 and today applications are countless. The ability of pulsed laser irradiation to melt the crystalline material and induce resolidification either into the crystalline or amorphous phase, depending on the irradiation conditions, has been observed already in 1979 by Liu et al 4 . In fact, the authors proposed this concept for data storage applications due to the optical contrast between the two phases. Several experimental parameters influence the melting and freezing kinetics of the material and thus the final phase obtained, the most important ones being the Appl. Phys. Lett. 110, 211602 (2017); doi: http://dx.doi.org/10.1063/1.4984110 2 laser pulse duration, wavelength and number of irradiation pulses, as well as film thickness and choice of substrate in the case of thin Si films [5][6][7][8][9][10] . Despite this early discovery, most laser-induced phase-change studies in Si focused on transforming large areas, for instance laser-annealing of amorphous Si for fabrication of solar cells 11,12 or OLED displays 13 . Less work has been done to imp...