High-temperature-processing-induced double-stacking-fault 3C-SiC inclusions in 4H SiC were studied with ballistic electron emission microscopy in ultrahigh vacuum. Distinctive quantum well structures corresponding to individual inclusions were found and the quantum well two-dimensional conduction band minimum was determined to be approximately 0.53Ϯ0.06 eV below the conduction band minimum of bulk 4H SiC. Macroscopic diode I-V measurements indicate no significant evidence of metal/semiconductor interface state variation across the inclusions. Quantum well ͑QW͒ structures in semiconductor materials have played an important role in the fabrication of semiconductor lasers and other devices. Most QW structures are fabricated by changing the chemical composition of epitaxial layers during growth. However, the polytypism of SiC has made possible a unique type of ''structure-only'' QW ͑with no change in composition, density, or nearest-neighbor stacking across the QW boundaries͒ involving thin layers of cubic 3C SiC ͑which has the smallest band gap among SiC polytypes͒ embedded in a higher band gap SiC host. 1 Recently, evidence of self-forming 3C inclusions in hexagonal SiC due to stacking fault formation along the ͑1000͒ hexagonal basal plane 2 has been observed in 4H-and 6H-SiC p-n diodes after high current operation, 3,4 and also in 4H-SiC materials with heavily n-type epilayers 5 or substrates 6,7 after high temperature processing. Observations of reduced-energy luminescence from these transformed materials and theoretical calculations of the band structure led to the proposal that the 3C inclusions in 4H and 6H SiC behave as electron QW's. 5,6,8 -10 In this Rapid Communication, we report high-resolution electronic characterization of individual 3C inclusions ͑of the ''double stacking fault'' type 5-7 ͒ that intersect a metalcoated 4H-SiC wafer surface using ballistic electron emission microscopy ͑BEEM͒. 11 The results directly verify the QW nature of the inclusions. We find that the QW states are propagating two-dimensional ͑2D͒ states with a 2D conduction band minimum ͑CBM͒ energy 0.53Ϯ0.06 eV lower than the 4H-SiC bulk CBM. Microscopic BEEM measurements as well as macroscopic diode I-V measurements show no evidence of significant metal/semiconductor ͑M/S͒ interface state variation across the inclusions. BEEM has previously been shown to be a powerful tool to investigate planar resonant tunneling structures located close to the M/S interface, 12 and our ''cross-sectional BEEM'' further extends its capability to probe propagating states in individual QW's.The original 4H-SiC samples of this study were 35 mm diameter wafers purchased from Cree, Inc. and were processed and first studied using electrical, optical, and structural methods at Arizona State University. 6,13 They had a 2 m lightly n-type N-doped ͓(1 -1.5)ϫ10 17 cm Ϫ3 ͔ epilayer on a heavily n-type N-doped (ϳ3ϫ10 19 cm Ϫ3 ) Si-face substrate with an 8°surface miscut from the basal plane. After being thermally oxidized at 1150°C for 90 min in dry oxygen,...