Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers

Abstract

3D Molded interconnect device (MID) is referred to as a new paradigm of manufacturing electronic circuits with high design complexity by removing conventional wiring processes. Basically, manufacturing of MIDs consists of several steps: building a structure, creating conductive traces, and pick-and-place of electrical components. A 3D structure was built in a commercial Additive manufacturing (AM) machine, and conductive wires were created using a silver paste on the 3D structure with a predetermined design of an electronic circuit. A Direct-print/cure (DPC) process was developed to draw the conductive wires on the surface and simultaneously harden the created wires using thermal/radiation energy. This DPC system consists of a micro-dispensing device and light focusing module installed in a motorized xyz stage. Resistors were also printed using the developed DPC system and a synthesized carbon nanotube (CNT)/polymer composite. The CNT/polymer composite was characterized through a rheology test and Thermal gravimetric analysis (TGA). The resistance of the printed resistor can be controlled by varying its length and the width. Finally, an automobile cruise controller was fabricated with redesigned circuits for the suggested process and materials, which is a promising technology for building 3D MID parts.

3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review

“…The selection of the right MID substrate is often a very challenge process that should be a balance between electrical, thermal and mechanical properties and the manufacturing cost [ 59 , 60 , 61 , 62 ].…”

Percolation effect of a Cu layer on a MWCNT/PP nanocomposite substrate after laser direct structuring and autocatalytic plating

“…2b. The average values of grayscale images were calculated by using eqn (2) and are given below each grayscale image Fig. 2b.…”

“…Electronic appliances on plastic substrates are widely utilized in various elds like the automotive industry, medicine and consumer electronics. [1][2][3][4] Fabrication of the monolithic integrated electric circuits on plastics is necessary for those application areas. Several methods are usually applied to make an electric circuit on plastic surfaces: laser-direct-imaging, 5 laserinduced selective activation (LISA) [6][7][8][9][10] and laser-directstructuring (LDS).…”

“…(a) Average value calculation of Cu grayscale image: step 1color image split to red (R), green (G) and blue (B) channels; step 2color-to-grayscale conversion by eqn (1); step 3average grayscale value of hGV Cu i ¼ 0.70 AE 0.02 evaluation by eqn (2). (b) Average value calculation of MWCNT/PP grayscale image: step 1color image split to R, G and B channels; step 2color-to-grayscale conversion by eqn (1); step 3average grayscale value of hGV MWCNT/PP i ¼ 0.080 AE 0.002 evaluation by eqn(2). (c) Image value threshold determination: step 1 -threshold of GV th ¼ 0.39 AE 0.02 calculation by eqn (3).…”

The use of 3D in‐mold decoration technology to form a film with printed circuits

“…A text, pattern, or microstructure is imposed on the products of injection molding to improve the appearance, variety, and functionality of the product. Direct-print (also called direct-write, DW) technology has been used in electronics, biofabrication, and tissue engineering [1][2][3][4][5][6] .…”