3D Molded interconnect device (MID) is referred to as a new paradigm of manufacturing electronic circuits with high design complexity by removing conventional wiring processes. Basically, manufacturing of MIDs consists of several steps: building a structure, creating conductive traces, and pick-and-place of electrical components. A 3D structure was built in a commercial Additive manufacturing (AM) machine, and conductive wires were created using a silver paste on the 3D structure with a predetermined design of an electronic circuit. A Direct-print/cure (DPC) process was developed to draw the conductive wires on the surface and simultaneously harden the created wires using thermal/radiation energy. This DPC system consists of a micro-dispensing device and light focusing module installed in a motorized xyz stage. Resistors were also printed using the developed DPC system and a synthesized carbon nanotube (CNT)/polymer composite. The CNT/polymer composite was characterized through a rheology test and Thermal gravimetric analysis (TGA). The resistance of the printed resistor can be controlled by varying its length and the width. Finally, an automobile cruise controller was fabricated with redesigned circuits for the suggested process and materials, which is a promising technology for building 3D MID parts.

No abstract

No abstract

No abstract

No abstract