2014
DOI: 10.1109/jphotov.2013.2279336
|View full text |Cite
|
Sign up to set email alerts
|

Direct Semiconductor Bonded 5J Cell for Space and Terrestrial Applications

Abstract: Spectrolab has demonstrated a 2.2/1.7/1.4/1.05/ 0.73 eV 5J cell with an efficiency of 37.8% under 1 sun AM1.5G spectrum and 35.1% efficiency for 1 sun AM0. The top three junctions and bottom two junctions were grown on GaAs and InP substrates, respectively, by metal organic vapor phase epitaxy. The GaAs-and InP-based cells were then direct bonded to create a lowresistance, high-transmissive interface. Both the space and terrestrial cells have high 1 sun V o c between 4.75 and 4.78 V. Initial tests of the terre… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

1
60
1
2

Year Published

2014
2014
2019
2019

Publication Types

Select...
5
4

Relationship

0
9

Authors

Journals

citations
Cited by 111 publications
(64 citation statements)
references
References 7 publications
1
60
1
2
Order By: Relevance
“…Wafer-bonding techniques have also been applied for fabricating the multi-junction solar cells. [15][16][17][18] However, conventional wafer-bonding techniques, such as plasmaactivated bonding and fused bonding, have a disadvantage in that they generally require high-temperature annealing, which could result in wafer bending and void formation at a bonding interface owing to the difference in thermal expansion coefficients. Even in the case of wafer-bonding between lattice-matched wafers, cracks and defects could be generated.…”
Section: Introductionmentioning
confidence: 99%
“…Wafer-bonding techniques have also been applied for fabricating the multi-junction solar cells. [15][16][17][18] However, conventional wafer-bonding techniques, such as plasmaactivated bonding and fused bonding, have a disadvantage in that they generally require high-temperature annealing, which could result in wafer bending and void formation at a bonding interface owing to the difference in thermal expansion coefficients. Even in the case of wafer-bonding between lattice-matched wafers, cracks and defects could be generated.…”
Section: Introductionmentioning
confidence: 99%
“…If the upper tandem is improperly biased at V oc as shown by the green-dashed curve, the lower tandem J sc increases by ~0.6 mA/cm 2 due to the artificially enhanced luminescent coupling. Under the proper conditions, the cumulative efficiency of the tandem is 30.21% + 8.54% = 38.8 ± 1 %, which is equal to the best reported efficiencies for twoterminal cells at 1 sun [12]. The uncertainty reflects an estimated 3% relative uncertainty in the individual measurements.…”
Section: Resultsmentioning
confidence: 62%
“…The upper tandem was grown inverted and the substrate was removed as part of the processing [19]. The lower tandem was grown upright on n-type InP and the substrate remained part of the final structure; this tandem is a version of the one included in the 5J wafer-bonded cell described in [12]. The process can be adapted to include an inverted bottom tandem.…”
Section: Solar Cell Fabricationmentioning
confidence: 99%
“…For example, a 5 junction GaAs/InP cell with an efficiency of 38.8% is demonstrated. [35] To pump the thermal energy from the dark world 31 Figure 4 a) The energy converting efficiency and yield of current PV devices (yellow) and the proposed infrared devices (red). b) The efficiency and energy gap of materials currently used in PV devices (yellow region) and that may be applied in the proposed infrared PV devices (red region).…”
Section: Feasibility For Pumping Thermal Energy From the Environmentmentioning
confidence: 99%