Direct writing laser lithography for production of microstructures

Ulrich, H.; Wijnaendts-van-Resandt, R.; Rensch, C.; Ehrensperger, W.

doi:10.1016/0167-9317(87)90019-0

Cited by 20 publications

(7 citation statements)

References 2 publications

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“…The required ratio between line distance L (digital pixel size or address grid) and spot size d of the writing beam has been calculated numerically assuming Gaussian beam conditions. 9 At a ratio d/L > 2, edge roughness is expected to be smaller than 0.1 ,m. A larger ratio should lead to smoother edges at the expense of increasing the writing time by a factor 1/L 2 .…”

Section: Ill Experimental Resultsmentioning

confidence: 98%

Laser scanner for direct writing lithography

et al. 1989

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Section: Ill Experimental Resultsmentioning

confidence: 98%

Laser scanner for direct writing lithography

et al. 1989

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“…The shape and dimension of such patterns can be eventually improved by employing and controlling a number of laser beams and the angle between them [ 41 ]. In addition to the laser properties, the spot size, the photoresist material, and the acceptable writing speed are also important requirements for creating a high fidelity pattern [ 42 ]. Despite the fact that this method can achieve finely patterned structures [ 43 , 44 ], there are cases in which the relief model is different from the design, which is inclusively due to mechanical instabilities and deformations caused by the processes of chemical development and drying or by the mechanical drifting of the focal spot position with respect to the sample [ 45 ].…”

Section: Top–down Lithographic Methodologiesmentioning

confidence: 99%

Multifunctional Structured Platforms: From Patterning of Polymer-Based Films to Their Subsequent Filling with Various Nanomaterials

Handrea-Dragan

Botiz

2021

Polymers

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There is an astonishing number of optoelectronic, photonic, biological, sensing, or storage media devices, just to name a few, that rely on a variety of extraordinary periodic surface relief miniaturized patterns fabricated on polymer-covered rigid or flexible substrates. Even more extraordinary is that these surface relief patterns can be further filled, in a more or less ordered fashion, with various functional nanomaterials and thus can lead to the realization of more complex structured architectures. These architectures can serve as multifunctional platforms for the design and the development of a multitude of novel, better performing nanotechnological applications. In this work, we aim to provide an extensive overview on how multifunctional structured platforms can be fabricated by outlining not only the main polymer patterning methodologies but also by emphasizing various deposition methods that can guide different structures of functional nanomaterials into periodic surface relief patterns. Our aim is to provide the readers with a toolbox of the most suitable patterning and deposition methodologies that could be easily identified and further combined when the fabrication of novel structured platforms exhibiting interesting properties is targeted.

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“…The performance of the direct laser lithography system is evaluated mainly based on the system parameters pertaining to the laser-writing tool and the light source [2]. Effective lithography system requires a precise laser focusing and a complete crosslinking of the photoresist [3]. Precise focusing enhances the performance and the resolution needed for the fabrication [4].…”

Section: Introductionmentioning

confidence: 99%

Studying the impact of depth of focus on 3D profile of negative photoresist material: a simulation approach

et al. 2020

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For quality patterning of microstructures, it is essential that all process parameters are optimized to ensure well-developed 3D profile of the resist. Advances in direct laser lithography have provided maskless and rapid prototyping methods of manufacturing microstructures. Among all other process parameters, the quality of the patterned structure is critically affected by the depth of focus adjustments of the laser spot. In this study, a simulation approach is adopted and the LAB Module of GenISys lithography simulation software is implemented to determine the optimum depth of focus for negative photoresist material. Modeling and studying straight-line structure at different focusing depths at constant exposure dosages is carried out in this work. At the constant dosage of 45 mJ/cm 2 , the 15 µm depth of focus yields the best quality for the 3D resist profile.

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Direct writing laser lithography for production of microstructures

Cited by 20 publications

References 2 publications

Laser scanner for direct writing lithography

Laser scanner for direct writing lithography

Multifunctional Structured Platforms: From Patterning of Polymer-Based Films to Their Subsequent Filling with Various Nanomaterials

Studying the impact of depth of focus on 3D profile of negative photoresist material: a simulation approach

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