2003
DOI: 10.1364/ao.42.006349
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Direct writing of microlenses in polycarbonate with excimer laser ablation

Abstract: A method for fabricating microlenses in polycarbonate material is reported. Using a direct-write technique based on scanning excimer laser ablation with a circular beam, we can etch an arbitrary shape in the polymer material. The beam is obtained by imaging a circular aperture onto the polymer surface, and scanning is realized by the translation stage carrying the sample, which makes successive contours with well-chosen diameters and scan velocities. Afterward, to smooth the ablated surface and release it from… Show more

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Cited by 75 publications
(51 citation statements)
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“…Several researchers have reported on fabrication methods for microlenses and lens arrays with these materials. They include techniques like photoresist reflow [8], laser beam shaping [9], deep lithography with protons [10], LIGA processing (German acronym for Lithographie, Galvanik und Abformung) [11], photopolymerization [12], microjet printing [13], laser ablation [14] and direct laser [15] or e-beam writing [16]. Some methods are relatively inexpensive and are based on existing technologies while others require dedicated processing tools and/or new materials with special properties.…”
Section: Microlens Fabrication Techniques: the Timelinementioning
confidence: 99%
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“…Several researchers have reported on fabrication methods for microlenses and lens arrays with these materials. They include techniques like photoresist reflow [8], laser beam shaping [9], deep lithography with protons [10], LIGA processing (German acronym for Lithographie, Galvanik und Abformung) [11], photopolymerization [12], microjet printing [13], laser ablation [14] and direct laser [15] or e-beam writing [16]. Some methods are relatively inexpensive and are based on existing technologies while others require dedicated processing tools and/or new materials with special properties.…”
Section: Microlens Fabrication Techniques: the Timelinementioning
confidence: 99%
“…Another asset of this approach is that a suitable choice of the photoresist material allows the use of well established, commercially available, semiconductor lithography equipment. Different types of direct writing techniques exist: direct laser writing [15], electron beam [16] and focused ion beam writing [37], and laser ablation [14]. For the sake of completeness, the fabrication by half-tone mask imaging [15,38]-although not strictly a direct writing technology-should also be mentioned.…”
Section: Direct Written Microlensesmentioning
confidence: 99%
“…Given the need to design and prepare masks for each project individually, they have a limited application in the field of fast prototyping. A different group of solutions are methods based on the use of special algorithms that address the laser beam on a 2D plane, while working in the direct writing mode directly on the material [10,11], or automatically assembling the virtual mask image with the use of different discrete motives [12].…”
Section: Introductionmentioning
confidence: 99%
“…One particularly interesting method of producing 3D microstructures while working in the laser direct writing (LDW) mode using 'Top-Hat' beam profile is called 'scanning contour ablation' (SCA), which was proposed by Naessens et al [11]. This method, in its basic form, bears on the ablation of consequent trenches in the form of concentric circles, which makes it ideal for the preparation of the structures with axial symmetry such as spherical microlenses.…”
Section: Introductionmentioning
confidence: 99%
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