Directed Self-Assembly (DSA) for contact applications

Weng, Ming-Hui; Ko, Tsung-Han; Lee, Chih-Jie; Shen, Han-Ping; Wu, Chia‐Lin; Hsieh, Ken-Hsien; Huang, Yuan-Chien; Wu, Cheng-Han; Lee, Chung-Ju; Chang, Ching-Yu; Lin, Chin-Hsiang

doi:10.1117/12.2303492

Cited by 1 publication

(1 citation statement)

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“…The first attempt at using DSA for hole patterning was performed in a PSb-PMMA system. Unlike line/space patterning, where the chemo-epitaxy flow is the preferred process based on experimental trials with 300 mm wafers, both graphoepitaxy and chemo-epitaxy are usable for hole patterning applications [99][100][101]. Similar to line/space patterning, defectivity is of great importance in evaluating the feasibility of DSA for hole patterning.…”

Section: Dsa For Hole Shrinkingmentioning

confidence: 99%

Directed self-assembly of block copolymers for sub-10 nm fabrication

Chen

Xiong

2020

Int. J. Extrem. Manuf.

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Directed self-assembly (DSA) emerges as one of the most promising new patterning techniques for single digit miniaturization and next generation lithography. DSA achieves high-resolution patterning by molecular assembly that circumvents the diffraction limit of conventional photolithography. Recently, the International Roadmap for Devices and Systems listed DSA as one of the advanced lithography techniques for the fabrication of 3–5 nm technology node devices. DSA can be combined with other lithography techniques, such as extreme ultra violet (EUV) and 193 nm immersion (193i), to further enhance the patterning resolution and the device density. So far, DSA has demonstrated its superior ability for the fabrication of nanoscale devices, such as fin field effect transistor and bit pattern media, offering a variety of configurations for high-density integration and low-cost manufacturing. Over 1 T in−2 device density can be achieved either by direct templating or coupled with nanoimprinting to improve the throughput. The development of high χ block copolymer further enhances the patterning resolution of DSA. In addition to its superiority in high-resolution patterning, the implementation of DSA on a 300 mm pivot line fully demonstrates its potential for large-scale, high-throughput, and cost-effective manufacturing in industrial environment.

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Section: Dsa For Hole Shrinkingmentioning

confidence: 99%