“…It is generally recognized that the strengths and electrical conductivities of Cu-Ni-Si alloys are closely dependent on their microstructure; at an early stage of aging, the strength of the alloys increases owing to the continuous nucleation and growth of the nano-scaled δ-Ni 2 Si precipitates (i.e., continuous precipitates (CPs)) in the matrix of Cu solid-solution phase [10][11][12][13][14][15][16][17] . Here, δ-Ni 2 Si has an orthorhombic structure (Space group: Pnma, lattice parameter: a = 0.504 nm, b = 0.364 nm, c = 0.708 nm) 14,17,18) . At a later stage of a prolonged aging, the strength decreases, which is primarily caused by the development of coarse cellular components consisting of the Cu solid-solution and ber-shaped δ-Ni 2 Ni phase (i.e., discontinuous precipitates (DPs)), accompanied by the consumption of the ne δ-Ni 2 Ni hardening species 17,[19][20][21] .…”