Discussion on Issues Toward 450 mm Wafer

Abstract

This reports a present status of recent technical discussions on 450mm wafer. Discussions are focusing on mechanical wafer specification, especially, wafer thickness based on thermal stress and other factors, which may determine correct, wafer thickness.

450 mm Silicon Wafers Challenges - Wafer Thickness Scaling

“…Lessons learned from past wafer size transitions (5) showed that once the wafer thickness is specified it is difficult to change. Based on the simulation data (4,5), some data using sintered polysilicon 450 mm wafer and suppliers input, an initial thickness of 925 ± 25 µm was recommended as a good thickness for handling wafers. This is thicker than the extrapolated thickness trend from 125 mm to 300 mm wafers, as shown in Figure 2.…”