In this work, we report on the thermal oxidation of AlInN/AlN/GaN heterostructures. A ‘nearly‐native’ Al2O3 oxide was formed during this procedure, which can be used as a gate oxide and thus enables the fabrication of MIS‐HFET. 2DEG density and, in particular, carrier mobility are strongly affected by the thermal treatment in O2 atmosphere. Hence, only a narrow processing window for successful thermal oxidation was identified, covering annealing temperatures between 700 °C and 800 °C and annealing durations of few minutes. Oxide thicknesses estimated to be in the range of 0.6 nm and 2.6 nm were fabricated, enabling a suppression of reverse leakage currents of MIS large‐area gate diodes by up to three orders of magnitude. The resulting oxide thickness scales well with the square root of oxidation time, indicating a diffusion of oxygen atoms into the barrier. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)